SCHEMBL2102319

SCHEMBL2102319

CCNC(NCC)=C([SiH3])Cl

nearest known ligand 0.39

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 1/20 0.39
ALDH1A1 P00352 1/20 0.36
CYP3A4 P08684 1/20 0.36
HTT P42858 1/20 0.32
KDM4A O75164 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL233761 0.73 KMT2A (0.40) KMT2AALDH1A1CYP3A4HTTKDM4A
SCHEMBL2101790 0.71
SCHEMBL2102317 0.69 KDM4A (0.36) ALDH1A1CYP3A4KDM4A
SCHEMBL2273368 0.67 KMT2A (0.36) KMT2AALDH1A1CYP3A4HTT
SCHEMBL2101593 0.67 KMT2A (0.36) KMT2AALDH1A1CYP3A4HTT
SCHEMBL232562 0.67 KMT2A (0.46) KMT2AALDH1A1CYP3A4HTTKDM4A
SCHEMBL2102787 0.65
SCHEMBL7737797 0.65
SCHEMBL2275764 0.64 KMT2A (0.33) KMT2AALDH1A1CYP3A4
SCHEMBL2267214 0.64 ALDH1A1 (0.31) ALDH1A1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed