SCHEMBL2102482

SCHEMBL2102482

CN[Si](Cl)(c1ccccc1)N(C)C

nearest known ligand 0.32

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.32
LMNA P02545 2/20 0.31
L3MBTL1 Q9Y468 1/20 0.31
ESR1 P03372 1/20 0.30
ESR2 Q92731 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2103257 0.79 KCNN4 (0.32) TSHRLMNA
SCHEMBL2102824 0.78
SCHEMBL2100803 0.73 TSHR (0.35) TSHRLMNAL3MBTL1ESR1ESR2
SCHEMBL2104633 0.72 ESR1 (0.34) TSHRLMNAESR1ESR2
SCHEMBL55438 0.72 ESR1 (0.34) TSHRLMNAESR1ESR2
SCHEMBL2102659 0.72 TSHR (0.38) TSHRLMNAL3MBTL1ESR1ESR2
SCHEMBL2100521 0.72 ESR1 (0.34) TSHRLMNAESR1ESR2
SCHEMBL2100774 0.72 TSHR (0.38) TSHRLMNAL3MBTL1ESR1ESR2
SCHEMBL2101836 0.72 KCNN4 (0.39) TSHRLMNAL3MBTL1ESR1ESR2
SCHEMBL2100797 0.70 ESR1 (0.38) TSHRESR1ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed