Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA12 | O43570 | 2/20 | 0.34 |
| ▸ | CA1 | P00915 | 2/20 | 0.34 |
| ▸ | CA9 | Q16790 | 2/20 | 0.34 |
| ▸ | PLA2G1B | P04054 | 1/20 | 0.31 |
| ▸ | PLA2G2A | P14555 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2103937 | 0.89 | CA12 (0.33) | CA12CA1CA9PLA2G1BPLA2G2A | |
| SCHEMBL2274193 | 0.81 | CA12 (0.34) | CA12CA1CA9 | |
| SCHEMBL2101788 | 0.75 | CA12 (0.32) | CA12CA1CA9 | |
| SCHEMBL2102870 | 0.75 | CA12 (0.32) | CA12CA1CA9 | |
| SCHEMBL2103238 | 0.75 | PLA2G1B (0.33) | CA12CA1CA9PLA2G1BPLA2G2A | |
| SCHEMBL2103882 | 0.74 | PLA2G1B (0.32) | CA12CA1CA9PLA2G1BPLA2G2A | |
| SCHEMBL16582983 | 0.71 | CA12 (0.37) | CA12CA1CA9 | |
| SCHEMBL16577646 | 0.71 | CA12 (0.39) | CA12CA1CA9PLA2G1BPLA2G2A | |
| SCHEMBL2271164 | 0.70 | CA12 (0.33) | CA12CA1CA9 | |
| SCHEMBL2101845 | 0.70 | KCNH2 (0.43) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8404584-B2 | Method of manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2013-03-26 | — | — | US | disclosed |
| US-8164166-B2 | Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2012-04-24 | — | — | US | disclosed |
| US-20110207319-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2011-08-25 | — | — | US | disclosed |
| US-20090085170-A1 | INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2009-04-02 | — | — | US | disclosed |