SCHEMBL2102722

SCHEMBL2102722

CCN(CC)[SiH2]C=CCCCN(C)C

nearest known ligand 0.33

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 3/20 0.33
ALDH1A1 P00352 1/20 0.33
TSHR P16473 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2103066 0.88
SCHEMBL2271525 0.81 TSHR (0.33) ALDH1A1TSHR
SCHEMBL2101406 0.74
SCHEMBL2100904 0.72 ALDH1A1 (0.38) DNM1ALDH1A1TSHR
SCHEMBL2100759 0.71 DNM1 (0.32) DNM1ALDH1A1TSHR
SCHEMBL24030556 0.69 DNM1 (0.48) DNM1ALDH1A1TSHR
SCHEMBL13868143 0.69 ALDH1A1 (0.43) DNM1ALDH1A1TSHR
SCHEMBL5082663 0.68 TSHR (0.30) ALDH1A1TSHR
SCHEMBL4901954 0.67 ALDH1A1 (0.41) DNM1ALDH1A1TSHR
SCHEMBL31275713 0.67 DNM1 (0.59) DNM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed