SCHEMBL2102805

SCHEMBL2102805

CCCC[Si](C)(N(CC)CC)N(CC)CC

nearest known ligand 0.32

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.32
LMNA P02545 1/20 0.32
THRB P10828 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2102778 0.87
SCHEMBL2103648 0.82
SCHEMBL2102515 0.79
SCHEMBL2271868 0.78 TSHR (0.32) TSHRLMNATHRB
SCHEMBL9950371 0.78 TSHR (0.32) TSHRLMNATHRB
SCHEMBL2099754 0.74 TSHR (0.33) TSHRLMNATHRB
SCHEMBL2100415 0.74 TSHR (0.33) TSHRLMNATHRB
SCHEMBL2102668 0.74 DNM1 (0.33) TSHRLMNATHRB
SCHEMBL2269801 0.74 TSHR (0.33) TSHRLMNATHRB
SCHEMBL2275365 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed