SCHEMBL2103085

SCHEMBL2103085

CCN[SiH](CCCN(C)C)N(CC)CC

nearest known ligand 0.33

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 3/20 0.33
ALDH1A1 P00352 2/20 0.33
TSHR P16473 1/20 0.33
CYP1A2 P05177 2/20 0.31
CYP2D6 P10635 1/20 0.31
HRH2 P25021 1/20 0.31
HRH4 Q9H3N8 1/20 0.31
TDP1 Q9NUW8 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2104483 0.88
SCHEMBL2100383 0.82 ALDH1A1 (0.35) DNM1ALDH1A1TSHR
SCHEMBL2100573 0.78
SCHEMBL2103909 0.74 ALDH1A1 (0.39) DNM1ALDH1A1TSHRCYP1A2CYP2D6
SCHEMBL2102714 0.74
SCHEMBL2104213 0.72
SCHEMBL2271644 0.72 ALDH1A1 (0.41) DNM1ALDH1A1TSHRCYP1A2CYP2D6
SCHEMBL2100577 0.68 PRMT3 (0.33)
SCHEMBL2103465 0.67
SCHEMBL2103389 0.67 TSHR (0.33) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed