⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15355988 | 0.69 | — | — | |
| SCHEMBL432563 | 0.62 | — | — | |
| SCHEMBL17046120 | 0.59 | — | — | |
| SCHEMBL19708169 | 0.59 | — | — | |
| SCHEMBL2100861 | 0.59 | — | — | |
| Dimethylamine SCHEMBL2503496 | 0.54 | — | — | |
| Dimethylamine SCHEMBL5164633 | 0.53 | — | — | |
| Dimethylamine SCHEMBL12415750 | 0.53 | — | — | |
| Dimethylamine SCHEMBL13695986 | 0.53 | — | — | |
| Dimethylamine SCHEMBL1030 | 0.53 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 71 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250054747-A1 | CONFORMAL DEPOSITION OF SILICON NITRIDE | LAM RES CORP (US) | 2025-02-13 | — | — | US | claimed |
| CN-118402039-A | Conformal deposition of silicon nitride | 朗姆研究公司 | 2024-07-26 | — | — | CN | claimed |
| WO-2023114641-A1 | CONFORMAL DEPOSITION OF SILICON NITRIDE | LAM RESEARCH CORPORATION (US) | 2023-06-22 | — | — | WO | claimed |
| US-12633499-B2 | Plasma processing device and plasma processing method | TOKYO ELECTRON LIMITED (JP) | 2026-05-19 | — | — | US | disclosed |
| US-20260076110-A1 | HYBRID ATOMIC LAYER DEPOSITION | LAM RES CORP (US) | 2026-03-12 | — | — | US | disclosed |
| US-20250372367-A1 | DEPOSITION AND ETCH OF SILICON-CONTAINING LAYER | LAM RES CORP (US) | 2025-12-04 | — | — | US | disclosed |
| US-20250197996-A1 | LOW-K DIELECTRIC PROTECTION DURING PLASMA DEPOSITION OF SILICON NITRIDE | LAM RES CORP (US) | 2025-06-19 | — | — | US | disclosed |
| US-20250188609-A1 | SEAM-FREE AND CRACK-FREE DEPOSITION | LAM RES CORP (US) | 2025-06-12 | — | — | US | disclosed |
| US-20250166989-A1 | THERMAL FILM DEPOSITION | LAM RES CORP (US) | 2025-05-22 | — | — | US | disclosed |
| CN-119895076-A | Method for depositing silicon-based dielectric film | 应用材料公司 | 2025-04-25 | — | — | CN | disclosed |
| CN-119776805-A | Modified silicon nitride film and preparation method and application thereof | 大连恒坤新材料有限公司 | 2025-04-08 | — | — | CN | disclosed |
| US-8164166-B2 | Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2012-04-24 | — | — | US | disclosed |
| US-20110245262-A1 | COMPOUNDS FOR TREATING PROLIFERATIVE DISORDERS | SYNTA PHARMACEUTICALS CORP. | 2011-10-06 | — | — | US | disclosed |
| US-20110207319-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2011-08-25 | — | — | US | disclosed |
| US-20090085170-A1 | INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2009-04-02 | — | — | US | disclosed |
| EP-0384183-A2 | Mixtures comprising silanol-terminated polydiorganosiloxane and processes | GENERAL ELECTRIC COMPANY (US) | 1990-08-29 | — | — | EP | disclosed |
| EP-0137883-B1 | END-CAPPING CATALYST FOR FORMING ALCOXY-FUNCTIONAL ONE COMPONENT RTV COMPOSITIONS | GENERAL ELECTRIC COMPANY (US) | 1989-02-15 | — | — | EP | disclosed |
| US-4528324-A | Process for producing RTV silicone rubber compositions using a devolatilizing extruder | GENERAL ELECTRIC COMPANY (US) | 1985-07-09 | — | — | US | disclosed |
| US-4515932-A | ROOM TEMPERATURE VULCANIZATION | GENERAL ELECTRIC COMPANY (US) | 1985-05-07 | — | — | US | disclosed |
| EP-0137883-A1 | End-capping catalyst for forming alcoxy-functional one component RTV compositions | GENERAL ELECTRIC COMPANY (US) | 1985-04-24 | — | — | EP | disclosed |