Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | RIPK1 | Q13546 | 7/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20164074 | 0.86 | RIPK1 (0.39) | RIPK1 | |
| SCHEMBL21044981 | 0.82 | RIPK1 (0.37) | RIPK1 | |
| SCHEMBL29480009 | 0.81 | RIPK1 (0.36) | RIPK1 | |
| SCHEMBL483319 | 0.80 | RIPK1 (0.33) | RIPK1 | |
| SCHEMBL27467810 | 0.79 | RIPK1 (0.39) | RIPK1 | |
| SCHEMBL30661229 | 0.79 | — | — | |
| SCHEMBL19970903 | 0.78 | RIPK1 (0.34) | RIPK1 | |
| SCHEMBL30661211 | 0.77 | RIPK1 (0.31) | RIPK1 | |
| SCHEMBL21044993 | 0.76 | RIPK1 (0.32) | RIPK1 | |
| SCHEMBL29480044 | 0.75 | MLYCD (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3893054-B1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORP (JP) | 2026-05-06 | — | — | EP | disclosed |
| EP-3893053-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE | FUJIFILM CORP (JP) | 2025-01-22 | — | — | EP | disclosed |
| US-12078929-B2 | Photosensitive resin composition, pattern forming method, cured film, laminate, and device | FUJIFILM CORPORATION (JP) | 2024-09-03 | — | — | US | disclosed |
| CN-114402256-A | Organic film, method for producing same, composition, laminate, and semiconductor device | 富士胶片株式会社 | 2022-04-26 | — | — | CN | disclosed |
| EP-3893054-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM Corporation (JP) | 2021-10-13 | — | — | EP | disclosed |
| EP-3893053-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE | FUJIFILM Corporation (JP) | 2021-10-13 | — | — | EP | disclosed |
| US-20210302835-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-30 | — | — | US | disclosed |
| US-20210302836-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-30 | — | — | US | disclosed |
| EP-3492982-B1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2020-11-11 | — | — | EP | disclosed |
| EP-3492982-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2019-06-05 | — | — | EP | disclosed |