SCHEMBL21044967

SCHEMBL21044967

C1=CC([Zr](C(c2ccccc2)c2ccccc2)(C(c2ccccc2)c2ccccc2)C(c2ccccc2)c2ccccc2)C=C1

nearest known ligand 0.33

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
▸ DPP4 P27487 2/20 0.33
▸ F2 P00734 1/20 0.33
▸ TSHR P16473 1/20 0.33
▸ HTR2A P28223 1/20 0.31
▸ TAAR1 Q96RJ0 1/20 0.31
▸ CYP2D6 P10635 1/20 0.30
▸ SRC P12931 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21044915 0.82 DPP4 (0.33) DPP4F2TSHRHTR2ATAAR1
SCHEMBL21044908 0.64 — —
SCHEMBL27509149 0.64 TSHR (0.31) TSHR
SCHEMBL28838086 0.64 CYP19A1 (0.39) DPP4F2TSHRHTR2ATAAR1
SCHEMBL21044895 0.61 LTA4H (0.33) TSHR
SCHEMBL21044968 0.61 ESR1 (0.33) —
SCHEMBL21044935 0.60 — —
SCHEMBL28049238 0.60 — —
SCHEMBL21044955 0.59 LTA4H (0.36) TSHR
SCHEMBL21044884 0.59 TSHR (0.39) TSHRHTR2ATAAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12393116-B2 Pattern forming method, photosensitive resin composition, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2025-08-19 — — US disclosed
CN-113383273-B Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2023-11-14 — — CN disclosed
CN-114402256-A Organic film, method for producing same, composition, laminate, and semiconductor device 富士胶片株式会社 2022-04-26 — — CN disclosed
EP-3492982-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2020-11-11 — — EP disclosed
EP-3492982-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2019-06-05 — — EP disclosed
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