SCHEMBL21044968

SCHEMBL21044968

C[Si](C)(c1ccccc1)[Zr](C1C=CC=C1)([Si](C)(C)c1ccccc1)[Si](C)(C)c1ccccc1

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
▸ ESR1 P03372 1/20 0.33
▸ ESR2 Q92731 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3994162 0.67 ESR1 (0.37) ESR1ESR2
SCHEMBL28355421 0.65 ESR1 (0.35) ESR1ESR2
SCHEMBL31598470 0.64 ESR1 (0.34) ESR1ESR2
SCHEMBL27473457 0.63 ESR1 (0.67) ESR1ESR2
SCHEMBL14819037 0.62 ESR1 (0.33) ESR1ESR2
SCHEMBL28049238 0.62 — —
SCHEMBL10838037 0.61 ESR1 (0.44) ESR1ESR2
SCHEMBL27099682 0.61 ESR1 (0.44) ESR1ESR2
SCHEMBL8384580 0.61 ESR1 (0.44) ESR1ESR2
SCHEMBL21044967 0.61 DPP4 (0.33) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12393116-B2 Pattern forming method, photosensitive resin composition, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2025-08-19 — — US disclosed
CN-113383273-B Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2023-11-14 — — CN disclosed
CN-114402256-A Organic film, method for producing same, composition, laminate, and semiconductor device 富士胶片株式会社 2022-04-26 — — CN disclosed
EP-3492982-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2020-11-11 — — EP disclosed
EP-3492982-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2019-06-05 — — EP disclosed
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