SCHEMBL21048728

SCHEMBL21048728

CCCCOC(=O)CCC(CCCC(C)(OOC(C)(C)C)OOC(C)(C)C)(OOC(C)(C)C)OOC(C)(C)C

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.39
HTR2C P28335 1/20 0.36
NAAA Q02083 1/20 0.36
ALDH1A1 P00352 5/20 0.35
DNM1 Q05193 1/20 0.34
ATM Q13315 1/20 0.33
PRSS1 P07477 1/20 0.33
PRSS2 P07478 1/20 0.33
PRSS3 P35030 1/20 0.33
MAPK1 P28482 2/20 0.33
MAPT P10636 1/20 0.32
RECQL P46063 1/20 0.32
RAD52 P43351 1/20 0.32
NPSR1 Q6W5P4 1/20 0.32
HPGD P15428 1/20 0.32
TSHR P16473 1/20 0.32
LMNA P02545 1/20 0.32
FAAH O00519 1/20 0.31
TDP1 Q9NUW8 1/20 0.31
MGLL Q99685 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL44038 0.88 DGKA (0.46) DGKAHTR2CNAAAALDH1A1DNM1
Hydrogen Peroxide SCHEMBL28176159 0.87 DGKA (0.44) DGKAHTR2CNAAAALDH1A1DNM1
Dodecane SCHEMBL12471512 0.85 DGKA (0.51) DGKAHTR2CNAAAALDH1A1DNM1
SCHEMBL19971908 0.82 NAAA (0.51) DGKAHTR2CNAAAALDH1A1DNM1
SCHEMBL1617950 0.81 DGKA (0.50) DGKAHTR2CNAAAALDH1A1DNM1
SCHEMBL17137758 0.81 DGKA (0.44) DGKAHTR2CNAAAALDH1A1DNM1
SCHEMBL3290108 0.80 NAAA (0.38) DGKAHTR2CNAAAALDH1A1DNM1
SCHEMBL28085612 0.78 DGKA (0.57) DGKAHTR2CNAAAALDH1A1DNM1
SCHEMBL21456968 0.77 DGKA (0.34) DGKAHTR2CNAAAALDH1A1DNM1
SCHEMBL11706849 0.77 DGKA (0.39) DGKADNM1MAPTTSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3128540-B1 THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICAL/ELECTRONIC COMPONENT KYOCERA CORP (JP) 2019-06-12 EP disclosed