SCHEMBL21060561

SCHEMBL21060561

CO[Si](CCCN)(OC)OC(C)CCNCc1ccccc1

nearest known ligand 0.42

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 7/20 0.42
KMT2A Q03164 7/20 0.42
MAOA P21397 1/20 0.39
TDP1 Q9NUW8 1/20 0.38
CHRM2 P08172 1/20 0.38
SIGMAR1 Q99720 3/20 0.36
SCN8A Q9UQD0 1/20 0.36
MITF O75030 2/20 0.36
LMNA P02545 1/20 0.36
CNR1 P21554 1/20 0.36
CNR2 P34972 1/20 0.36
GPR35 Q9HC97 1/20 0.36
GPR55 Q9Y2T6 1/20 0.36
XBP1 P17861 1/20 0.36
MAPK1 P28482 1/20 0.36
HTT P42858 1/20 0.36
NPSR1 Q6W5P4 1/20 0.36
TLR2 O60603 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5810211 0.88 MEN1 (0.38) MEN1KMT2AMAOATDP1CHRM2
SCHEMBL3409956 0.84 MEN1 (0.37) MEN1KMT2AMAOATDP1CHRM2
Hydrochloric Acid SCHEMBL28376692 0.83 MEN1 (0.36) MEN1KMT2AMAOATDP1CHRM2
SCHEMBL29015749 0.79 MAOA (0.49) MEN1KMT2AMAOATDP1CHRM2
SCHEMBL21060566 0.79 MAOA (0.40) MEN1KMT2AMAOATDP1CHRM2
SCHEMBL28233872 0.79 CHRNB2 (0.38) MAOASIGMAR1
SCHEMBL3163436 0.79 SCN8A (0.47) MEN1KMT2AMAOATDP1CHRM2
SCHEMBL28644165 0.78 TLR2 (0.39) MAOASIGMAR1TLR2
SCHEMBL29551439 0.77 CHRM2 (0.49) MEN1KMT2AMAOATDP1CHRM2
SCHEMBL5203912 0.76 MAOA (0.45) MEN1KMT2AMAOATDP1CHRM2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119654696-A Method for manufacturing substrate laminate and semiconductor device 三井化学株式会社 2025-03-18 CN disclosed
CN-119497906-A Method for producing substrate laminate and substrate laminate 三井化学株式会社 2025-02-21 CN disclosed
CN-115956098-B Composition, laminate, and method for producing laminate 三井化学株式会社 2024-11-26 CN disclosed
CN-117070147-A Composition for producing film for semiconductor device and method for producing same 三井化学株式会社 2023-11-17 CN disclosed
CN-108352320-B Film composition for semiconductor, method for producing same, and semiconductor device 三井化学株式会社 2023-09-08 CN disclosed
US-11209735-B2 Composition for forming metal-containing film, method of producing composition for forming metal-containing film, semiconductor device, and method of producing semiconductor device MITSUI CHEMICALS, INC. (JP) 2021-12-28 US disclosed
US-20190187560-A1 COMPOSITION FOR FORMING METAL-CONTAINING FILM, METHOD OF PRODUCING COMPOSITION FOR FORMING METAL-CONTAINING FILM, SEMICONDUCTOR DEVICE, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE MITSUI CHEMICALS, INC. (JP) 2019-06-20 US disclosed