SCHEMBL21065528

SCHEMBL21065528

CCCC1CC(C)C(N)C(C)C1

nearest known ligand 0.34

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
▸ NOS3 P29474 3/20 0.34
▸ NOS1 P29475 3/20 0.34
▸ NOS2 P35228 3/20 0.34
▸ FYN P06241 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10596801 0.87 — —
SCHEMBL21381501 0.86 CYP1A2 (0.43) NOS3NOS1NOS2
SCHEMBL28305251 0.85 — —
SCHEMBL20604050 0.82 — —
SCHEMBL21382099 0.82 SIGMAR1 (0.30) —
SCHEMBL28306379 0.82 — —
SCHEMBL21381534 0.79 NOS3 (0.30) NOS3NOS1NOS2
SCHEMBL12663108 0.76 — —
SCHEMBL197616 0.76 — —
SCHEMBL15373069 0.76 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111019342-B Impact-modified polyamide molding compounds EMS专利股份公司 2023-12-12 — — CN claimed
CN-114163631-A Polyamide and preparation method and application thereof 上海凯赛生物技术股份有限公司 2022-03-11 — — CN claimed
CN-111712530-A Polyamide moulding compound EMS专利股份公司 2020-09-25 — — CN claimed
CN-111019342-A Impact-modified polyamide moulding materials EMS专利股份公司 2020-04-17 — — CN claimed
CN-113527101-B Novel compound, polymer, process for producing the same, photosensitive resin composition, pattern forming process, cured film, and electronic component 信越化学工业株式会社 2024-04-23 — — CN disclosed
CN-111019342-B Impact-modified polyamide molding compounds EMS专利股份公司 2023-12-12 — — CN disclosed
CN-114163631-B Polyamide and preparation method and application thereof 上海凯赛生物技术股份有限公司 2023-12-08 — — CN disclosed
CN-111830785-B Resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protecting film, and electronic component 信越化学工业株式会社 2023-08-22 — — CN disclosed
CN-112004853-B Aqueous composition containing uretdione groups and process for preparing the same 科思创知识产权两合公司 2023-07-28 — — CN disclosed
CN-112041367-B Aqueous composition containing uretdione groups and process for preparing the same 科思创知识产权两合公司 2023-05-16 — — CN disclosed
CN-111712530-B Polyamide moulding compound EMS专利股份公司 2023-05-16 — — CN disclosed
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 — — CN disclosed
CN-105593269-A Polyimide precursor, polyimide resin film obtained therefrom, and display element, optical element, light-receiving element, touch panel, circuit board, organic EL display, and method for producing organic EL element and color filter each containing same TORAY INDUSTRIES 2016-05-18 — — CN disclosed
CN-102292367-B Polyurethane casting material BAYER MATERIALSCIENCE AG 2014-01-08 — — CN disclosed
CN-103119077-A Polyurethane having high light refraction BAYER IP GMBH 2013-05-22 — — CN disclosed
CN-103080177-A Polyurethane with low volume shrinkage BAYER IP GMBH 2013-05-01 — — CN disclosed
CN-101541847-B Spray-applied polyurethane urea compounds based on polyisocyanate prepolymers containing soft segments BAYER MATERIALSCIENCE LLC 2012-05-30 — — CN disclosed
CN-102432799-A Phase-stable polyol mixture BAYER MATERIALSCIENCE LLC 2012-05-02 — — CN disclosed
CN-101195711-A Polyamic acid composition and alignment film prepared from same DALI POLYMER CO LTD (CN) 2008-06-11 — — CN disclosed
CN-101049747-A Composite parts comprising sprayed polyurethaneureas BAYER MATERIALSCIENCE LLC (US) 2007-10-10 — — CN disclosed
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