Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APP | P05067 | 1/20 | 0.46 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.38 |
| ▸ | PDE4A | P27815 | 1/20 | 0.38 |
| ▸ | LMNA | P02545 | 1/20 | 0.38 |
| ▸ | SLC6A6 | P31641 | 1/20 | 0.38 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.38 |
| ▸ | BLM | P54132 | 1/20 | 0.38 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10484655 | 0.97 | APP (0.44) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL518982 | 0.97 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL16500026 | 0.95 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL16499985 | 0.95 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL600058 | 0.92 | APP (0.44) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL1646543 | 0.92 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL929912 | 0.92 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL211369 | 0.92 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL1258894 | 0.92 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL220968 | 0.89 | APP (0.50) | APPPTGS1PDE4ALMNASLC6A6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1865093-B1 | Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating | JX NIPPON MINING & METALS CORP (JP) | 2012-03-28 | — | — | EP | disclosed |
| EP-1249517-B1 | METHOD OF COPPER ELECTROPLATING with pretreatment | NIPPON MINING CO (JP) | 2011-01-12 | — | — | EP | disclosed |
| EP-1865093-A1 | Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating | Nippon Mining & Metals Co., Ltd. (JP) | 2007-12-12 | — | — | EP | disclosed |
| US-6562222-B1 | Copper sulfate, sulfuric acid, chlorine, silane coupling agent; semiconductors | NIKKO MATERIALS COMPANY, LIMITED (JP) | 2003-05-13 | — | — | US | disclosed |
| EP-1249517-A1 | COPPER ELECTROPLATING LIQUID, PRETREATMENT LIQUID FOR COPPER ELECTROPLATING AND METHOD OF COPPER ELECTROPLATING | Nikko Materials Company, Limited (JP) | 2002-10-16 | — | — | EP | disclosed |