SCHEMBL2113883

SCHEMBL2113883

C=C(c1ccccc1)c1ccccc1O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 7/20 0.50
KDM4E B2RXH2 7/20 0.50
SMN1; SMN2 Q16637 4/20 0.50
ALDH1A1 P00352 4/20 0.50
CA12 O43570 2/20 0.50
CA2 P00918 2/20 0.50
CA4 P22748 2/20 0.50
CA14 Q9ULX7 2/20 0.50
CA1 P00915 1/20 0.50
HMGB1 P09429 1/20 0.50
CA6 P23280 1/20 0.50
CA7 P43166 1/20 0.50
CA9 Q16790 1/20 0.50
NAPRT Q6XQN6 1/20 0.50
MAPT P10636 5/20 0.47
CYP3A4 P08684 2/20 0.47
HSD17B10 Q99714 5/20 0.43
TSHR P16473 2/20 0.43
GSTA1 P08263 1/20 0.43
MEN1 O00255 6/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4801020 0.85 HPGD (0.52) HPGDKDM4ESMN1; SMN2ALDH1A1CA12
SCHEMBL5694037 0.85 MEN1 (0.48) SMN1; SMN2ALDH1A1NAPRTMAPTCYP3A4
SCHEMBL28405028 0.80 LIG1 (0.42) HPGDKDM4ESMN1; SMN2ALDH1A1CA12
SCHEMBL9715736 0.79 HPGD (0.48) HPGDKDM4ESMN1; SMN2ALDH1A1CA12
SCHEMBL19433122 0.79 MEN1 (0.61) HPGDKDM4ESMN1; SMN2ALDH1A1CA12
SCHEMBL10728975 0.79 MEN1 (0.46) HPGDKDM4ESMN1; SMN2ALDH1A1CA12
SCHEMBL10765081 0.78 MEN1 (0.43) ALDH1A1NAPRTMAPTCYP3A4HSD17B10
SCHEMBL3190837 0.77 HPGD (0.56) HPGDKDM4ESMN1; SMN2ALDH1A1CA12
SCHEMBL7118091 0.76 MEN1 (0.42) ALDH1A1NAPRTMAPTTSHRMEN1
SCHEMBL11360605 0.76 MEN1 (0.42) SMN1; SMN2ALDH1A1NAPRTMAPTHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-62263108-A None JP disclosed
CN-108700808-B Masking resist composition for etching, method for producing substrate using same, and method for producing light-emitting element 东丽株式会社 2024-04-05 CN disclosed
EP-3392292-B1 METHOD FOR PRODUCING HETEROCYCLE-CONTAINING POLYMER PRECURSOR, HETEROCYCLE-CONTAINING POLYMER PRECURSOR, AND USE FOR SAME FUJIFILM CORP (JP) 2023-06-28 EP disclosed
CN-108780275-B Photosensitive film 东丽株式会社 2022-11-08 CN disclosed
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same TORAY INDUSTRIES, INC. (JP) 2022-05-17 US disclosed
CN-109153841-B Resin composition 东丽株式会社 2021-12-31 CN disclosed
US-10990008-B2 Resin composition TORAY INDUSTRIES, INC. (JP) 2021-04-27 US disclosed
CN-108368263-B Resin, paste, laminate obtained using the same, and method for producing the laminate 东丽株式会社 2021-03-12 CN disclosed
CN-107407878-B Photosensitive resin composition 东丽株式会社 2020-11-17 CN disclosed
CN-107709407-B Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, semiconductor device, and method for producing polyimide precursor composition 富士胶片株式会社 2020-11-17 CN disclosed
EP-2110708-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION Toray Industries, Inc. (JP) 2009-10-21 EP disclosed
US-20090123867-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION PROMOTER TORAY INDUSTRIES, INC. (JP) 2009-05-14 US disclosed
US-7507518-B2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2009-03-24 US disclosed
US-7455948-B2 Photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2008-11-25 US disclosed
EP-1909142-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER TORAY INDUSTRIES, INC. (JP) 2008-04-09 EP disclosed
EP-1662319-A2 Photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2006-05-31 EP disclosed
US-20060110680-A1 Photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2006-05-25 US disclosed
US-20050014876-A1 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-20 US disclosed
EP-1496395-A2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-12 EP disclosed
JP-S62263108-A INSECTICIDE COMPOSITION FOR AGRICULTURE AND HORTICULTURE MITSUBISHI CHEM IND LTD 1987-11-16 JP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20090123867-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION PROMOTER PCNA, TERB1, SMC2 HPGD 3669/4885KDM4E 151/4885SMN1; SMN2 3418/4885
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same EED, RPL19, RARA HPGD 2150/4885KDM4E 1157/4885SMN1; SMN2 2472/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.