Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.40 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.40 |
| ▸ | TSHR | P16473 | 2/20 | 0.39 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.35 |
| ▸ | PKM | P14618 | 1/20 | 0.32 |
| ▸ | TP53 | P04637 | 1/20 | 0.32 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.32 |
| ▸ | GLA | P06280 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL733109 | 0.85 | TSHR (0.50) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL9565285 | 0.79 | TSHR (0.41) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL14415206 | 0.79 | TSHR (0.44) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL27524327 | 0.79 | SMN1; SMN2 (0.54) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL14062955 | 0.79 | TSHR (0.44) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL284231 | 0.79 | SMN1; SMN2 (0.43) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL17090758 | 0.79 | SMN1; SMN2 (0.54) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL24452968 | 0.78 | TSHR (0.38) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| Methane SCHEMBL11467272 | 0.78 | TSHR (0.40) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL1758266 | 0.77 | TSHR (0.36) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112877010-A | Natural rubber and metal hot vulcanization adhesive as well as preparation method and application thereof | 中北大学 | 2021-06-01 | — | — | CN | claimed |
| EP-0136257-B1 | SPHERICAL AMORPHOUS QUARTZ AND ITS USE IN FILLERS AND RESIN COMPOSITIONS | CIBA-GEIGY AG (CH) | 1988-01-20 | — | — | EP | claimed |
| CN-115820166-A | Adhesive for bonding polyphosphazene rubber and metal, preparation method and application | 西安近代化学研究所 | 2023-03-21 | — | — | CN | disclosed |
| CN-115039029-A | Negative photosensitive resin composition and method for producing cured relief pattern | 旭化成株式会社 | 2022-09-09 | — | — | CN | disclosed |
| CN-111448275-B | Adhesive laminate, method for producing object with resin film, and method for producing cured sealing body with cured resin film | 琳得科株式会社 | 2022-04-22 | — | — | CN | disclosed |
| CN-113345624-A | Insulating coated conductive particle, anisotropic conductive adhesive, and connection structure | 昭和电工材料株式会社 | 2021-09-03 | — | — | CN | disclosed |
| CN-113227234-A | Resin composition for forming resist pattern and method for manufacturing semiconductor article | 株式会社钟化 | 2021-08-06 | — | — | CN | disclosed |
| CN-109219637-B | Sealing composition and semiconductor device | 昭和电工材料株式会社 | 2021-05-25 | — | — | CN | disclosed |
| CN-111601849-A | Sealing composition, method for producing same, and semiconductor device | 日立化成株式会社 | 2020-08-28 | — | — | CN | disclosed |
| CN-111566163-A | Sealing composition and semiconductor device | 日立化成株式会社 | 2020-08-21 | — | — | CN | disclosed |
| CN-111566162-A | Sealing composition and semiconductor device | 日立化成株式会社 | 2020-08-21 | — | — | CN | disclosed |
| US-8159635-B2 | Liquid crystal display device | FUJIFILM CORPORATION (JP) | 2012-04-17 | — | — | US | disclosed |
| US-8044126-B2 | Polyarylene sulfide resin composition, production method thereof and surface mount electronic component | DIC CORPORATION (JP) | 2011-10-25 | — | — | US | disclosed |
| US-20100328584-A1 | LIQUID CRYSTAL DISPLAY DEVICE | FUJIFILM CORPORATION (JP) | 2010-12-30 | — | — | US | disclosed |
| US-20100331463-A1 | POLYARYLENE SULFIDE RESIN COMPOSITION, PRODUCTION METHOD THEREOF AND SURFACE MOUNT ELECTRONIC COMPONENT | DIC CORPORATION (JP) | 2010-12-30 | — | — | US | disclosed |
| EP-2236560-A1 | POLY(ARYLENE SULFIDE) RESIN COMPOSITION, PROCESS FOR PRODUCTION THEREOF, AND SURFACE MOUNT ELECTRONIC COMPONENT | DIC Corporation (JP) | 2010-10-06 | — | — | EP | disclosed |
| US-20050089694-A1 | Silane coated substrate | MOFFATT WILLIAM A (US) | 2005-04-28 | — | — | US | disclosed |
| US-20050089695-A1 | Silane coated substrate | MOFFAT WILLIAM A (US) | 2005-04-28 | — | — | US | disclosed |
| CN-1392890-A | Curable composition and use thereof | MITSUI CHEMICALS INC (JP) | 2003-01-22 | — | — | CN | disclosed |
| EP-0136257-B1 | SPHERICAL AMORPHOUS QUARTZ AND ITS USE IN FILLERS AND RESIN COMPOSITIONS | CIBA-GEIGY AG (CH) | 1988-01-20 | — | — | EP | disclosed |