SCHEMBL2115165

SCHEMBL2115165

O=S(=O)(c1cc(Cl)c(O)cc1O)c1cc(Cl)c(O)cc1O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.46
HSD17B10 Q99714 3/20 0.46
HPGD P15428 1/20 0.46
ACLY P53396 3/20 0.41
CA1 P00915 4/20 0.41
CA2 P00918 4/20 0.41
POLB P06746 2/20 0.40
TDP1 Q9NUW8 2/20 0.37
ALPL P05186 1/20 0.37
ALPI P09923 1/20 0.37
ALPG P10696 1/20 0.37
DNMT1 P26358 1/20 0.37
MCL1 Q07820 1/20 0.37
L3MBTL1 Q9Y468 1/20 0.37
HSP90AA1 P07900 2/20 0.36
ALDH1A1 P00352 1/20 0.36
CYP3A4 P08684 1/20 0.36
ADRA1A P35348 1/20 0.35
HSD17B3 P37058 1/20 0.35
HSD17B2 P37059 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9750079 0.86 TSHR (0.52) TSHRHSD17B10HPGDACLYCA1
SCHEMBL3480593 0.82 POLB (0.59) HSD17B10ACLYCA1CA2POLB
SCHEMBL9566720 0.79 HSD17B10 (0.50) TSHRHSD17B10HPGDACLYCA1
SCHEMBL10813290 0.77 HSD17B10 (0.48) TSHRHSD17B10HPGDACLYCA1
SCHEMBL9698646 0.76 CA1 (0.55) TSHRHSD17B10HPGDCA1CA2
SCHEMBL5635695 0.74 TSHR (0.50) TSHRHSD17B10HPGDACLYCA1
SCHEMBL9566724 0.74 HSD17B10 (0.50) TSHRHSD17B10HPGDCA1CA2
SCHEMBL69259 0.73 HSD17B10 (0.80) TSHRHSD17B10HPGDCA1CA2
SCHEMBL6894760 0.71 HSD17B10 (0.46) TSHRHSD17B10HPGDACLYCA1
SCHEMBL6548470 0.71 HSD17B10 (0.46) TSHRHSD17B10HPGDCA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-102439242-B Multiwall sheet, article, and method of making a multiwall sheet SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2015-11-25 CN disclosed
CN-102439242-A Multiwall sheet, article, and method of making a multiwall sheet SABIC INNOVATIVE PLASTICS IP 2012-05-02 CN disclosed
US-8158568-B2 Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith TOKYO OHKA KOGYO CO., LTD. (JP) 2012-04-17 US disclosed
EP-1641908-B1 CLEANING COMPOSITION, METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE, AND METHOD OF FORMING WIRING ON SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO LTD (JP) 2010-11-17 EP disclosed
US-20100248477-A1 Cleaning liquid used in process for forming dual damascene structure and a process for treating a substrate therewith YOKOI SHIGERU 2010-09-30 US disclosed
US-20100051582-A1 Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith YOKOI SHIGERU 2010-03-04 US disclosed
US-20090156005-A1 Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith YOKOI SHIGERU 2009-06-18 US disclosed
US-7442675-B2 Cleaning composition and method of cleaning semiconductor substrate TOKYO OHKA KOGYO CO., LTD. (JP) 2008-10-28 US disclosed
US-7179399-B2 Material for forming protective film TOKYO OHKA KOGYO CO., LTD. (JP) 2007-02-20 US disclosed
US-20060241012-A1 Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith YOKOI SHIGERU 2006-10-26 US disclosed
US-6544717-B2 Antireflective coating TOKYO OHKA KOGYO CO., LTD. (JP) 2003-04-08 US disclosed
US-20030032280-A1 Method for filling fine hole TOKYO OHKA KOGYO CO., LTD. (JP) 2003-02-13 US disclosed
US-6515073-B2 Comprising di-, tri- and/or tetra-(alkoxy/phenoxy)silanes and a thermosetting resin which can be condensed therewith which has an absorption capacity with respect to exposing light; can be etched at high rate for fine resist patterns TOKYO OHKA KOGYO CO., LTD. (JP) 2003-02-04 US disclosed
US-20020182360-A1 Material for forming protective film TOKYO OHKA KOGYO CO., LTD. (JP) 2002-12-05 US disclosed
US-20020055064-A1 Anti-reflective coating composition, multilayer photoresist material using the same, and method for forming pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2002-05-09 US disclosed
US-20010049072-A1 Undercoating composition for photolithographic resist HIROSAKI TAKAKO (JP) 2001-12-06 US disclosed
US-20010036998-A1 Anti-reflective coating-forming composition TOKYO OHKA KOGYO CO., LTD. (JP) 2001-11-01 US disclosed
US-6284428-B1 FOR FORMING OF ANTIREFLECTION UNDERCOATING LAYER TO INTERVENE BETWEEN SURFACE OF SUBSTRATE AND PHOTORESIST LAYER TO BE PATTERNED IN MANUFACTURING PROCESS OF SEMICONDUCTOR DEVICES TOKYO OHKA KOGYO CO., LTD, (JP) 2001-09-04 US disclosed
US-20010018163-A1 Undercoating composition for photolithographic resist TOKYO OHKA KOGYO CO., LTD. (JP) 2001-08-30 US disclosed
EP-0206103-B1 POLYCARBONATE COMPOSITION GENERAL ELECTRIC COMPANY (US) 1990-09-05 EP disclosed