SCHEMBL2116984

SCHEMBL2116984

CCC(C)(O)C#Cc1c[c]ccc1

nearest known ligand 0.43

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
MAPT P10636 1/20 0.43
PGK1 P00558 1/20 0.32
KMT2A Q03164 1/20 0.30
ATM Q13315 1/20 0.30
CCNB2 O95067 1/20 0.30
CDK1 P06493 1/20 0.30
CCNB1 P14635 1/20 0.30
CDK5 Q00535 1/20 0.30
CCNB3 Q8WWL7 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2114163 0.85 MAPT (0.34) MAPT
SCHEMBL2114627 0.83 ASIC3 (0.37) MAPTKMT2AATM
SCHEMBL2118609 0.80 MAPT (0.44) MAPTPGK1KMT2AATMCCNB2
SCHEMBL11048323 0.79 MAPT (0.64) MAPTPGK1KMT2ACCNB2CDK1
SCHEMBL14814587 0.79 HRH3 (0.34) MAPT
SCHEMBL482776 0.72 NPSR1 (0.39)
SCHEMBL14177740 0.71 MAPT (0.43) MAPTPGK1
SCHEMBL11443958 0.71 MAPT (0.43) MAPTPGK1KMT2ACCNB2CDK1
SCHEMBL614112 0.69 HRH3 (0.38)
SCHEMBL1978211 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2555053-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-18 EP disclosed
EP-2555053-A1 Positive-type photosensitive resin composition Toray Industries, Inc. (JP) 2013-02-06 EP disclosed
EP-2110708-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2012-12-05 EP disclosed
US-8158324-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2012-04-17 US disclosed
US-20100099041-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-04-22 US disclosed
EP-2110708-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION Toray Industries, Inc. (JP) 2009-10-21 EP disclosed