SCHEMBL21180368

SCHEMBL21180368

Nc1cccc(-c2nc3c[c]ccc3o2)c1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 15/20 0.60
RAB9A P51151 14/20 0.60
KDM4E B2RXH2 9/20 0.60
MAPT P10636 9/20 0.60
ALDH1A1 P00352 8/20 0.60
NFKB1 P19838 2/20 0.60
NFKB2 Q00653 2/20 0.60
RELA Q04206 2/20 0.60
SMN1; SMN2 Q16637 8/20 0.57
HPGD P15428 5/20 0.57
KMT2A Q03164 8/20 0.56
MEN1 O00255 7/20 0.56
GAA P10253 2/20 0.56
CACNA1B Q00975 1/20 0.56
APBA1 Q02410 1/20 0.56
HSD17B10 Q99714 3/20 0.53
TP53 P04637 3/20 0.53
GFER P55789 2/20 0.48
RXFP1 Q9HBX9 2/20 0.48
MECP2 P51608 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21179431 0.89 NPC1 (0.60) NPC1RAB9AKDM4EMAPTALDH1A1
SCHEMBL6703273 0.83 UTRN (0.47) NPC1RAB9AKDM4EMAPTALDH1A1
SCHEMBL27652505 0.83 SMN1; SMN2 (0.52) NPC1RAB9AKDM4EMAPTALDH1A1
SCHEMBL27957151 0.82 RAB9A (0.61) NPC1RAB9AKDM4EMAPTALDH1A1
SCHEMBL142199 0.82 SMN1; SMN2 (0.53) NPC1RAB9AKDM4EMAPTALDH1A1
SCHEMBL2270976 0.80 NPC1 (0.78) NPC1RAB9AKDM4EMAPTALDH1A1
SCHEMBL29364223 0.80 NPC1 (0.78) NPC1RAB9AKDM4EMAPTALDH1A1
SCHEMBL760587 0.80 NPC1 (0.68) NPC1RAB9AKDM4EMAPTALDH1A1
SCHEMBL12209706 0.80 NPC1 (0.72) NPC1RAB9AKDM4EMAPTALDH1A1
SCHEMBL694271 0.80 SMN1; SMN2 (0.64) NPC1RAB9AKDM4EMAPTALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103755987-A Preparation method for heat-resisting and high-transparence polyimide thin film JIANGSU ICE CITY INSULATION MATERIALS STOCK CO LTD 2014-04-30 CN claimed
WO-2021020344-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE SHEET, CURED FILM, METHOD FOR PRODUCING CURED FILM, INTERLAYER INSULATING FILM AND ELECTRONIC COMPONENT 東レ株式会社 2021-02-04 WO disclosed
WO-2019142703-A1 RESIN COMPOSITION FOR DISPLAY SUBSTRATE, RESIN FILM FOR DISPLAY SUBSTRATE AND LAMINATE BODY CONTAINING THIS, IMAGE DISPLAY DEVICE, ORGANIC EL DISPLAY, AND MANUFACTURING METHOD OF THESE 東レ株式会社 2019-07-25 WO disclosed
CN-108027557-B Cured film and its manufacturing method 东丽株式会社 2019-05-28 CN disclosed
CN-108473679-A Cured film and its manufacturing method 东丽株式会社 2018-08-31 CN disclosed
CN-108027557-A Cured film and its manufacture method 东丽株式会社 2018-05-11 CN disclosed
CN-107405907-A Laminated resin film and the layered product containing it, TFT substrate, organic EL element colour filter, and their manufacture method 东丽株式会社 2017-11-28 CN disclosed
CN-104204037-B Polyamic acid and containing its resin combination 东丽株式会社 2016-08-24 CN disclosed
CN-103755987-A Preparation method for heat-resisting and high-transparence polyimide thin film JIANGSU ICE CITY INSULATION MATERIALS STOCK CO LTD 2014-04-30 CN disclosed