SCHEMBL21239986

SCHEMBL21239986

NS(=O)(=O)c1ccccc1-c1ccccc1NC(=O)Nc1ccccc1

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA2 P00918 14/20 0.63
CA1 P00915 13/20 0.63
CA12 O43570 13/20 0.63
CA9 Q16790 13/20 0.63
MEN1 O00255 2/20 0.54
KMT2A Q03164 2/20 0.54
NPC1 O15118 1/20 0.54
LMNA P02545 1/20 0.54
HTT P42858 1/20 0.54
RAB9A P51151 1/20 0.54
MAPT P10636 1/20 0.52
CYP1A2 P05177 2/20 0.51
TP53 P04637 1/20 0.50
EPHX1 P07099 1/20 0.50
TSHR P16473 1/20 0.50
EPHX2 P34913 1/20 0.50
CDK9 P50750 1/20 0.50
SMN1; SMN2 Q16637 1/20 0.50
CLK4 Q9HAZ1 1/20 0.50
POLB P06746 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29821990 1.00 CA2 (0.63) CA2CA1CA12CA9MEN1
SCHEMBL3815711 0.88 CA1 (0.66) CA2CA1CA12CA9MEN1
SCHEMBL29988500 0.88 CA1 (0.66) CA2CA1CA12CA9MEN1
SCHEMBL26605988 0.87 CA12 (0.53) CA2CA1CA12CA9MEN1
SCHEMBL22729210 0.80 CA1 (0.56) CA2CA1CA12CA9MEN1
SCHEMBL11884170 0.78 MEN1 (0.60) CA2CA1CA12CA9MEN1
SCHEMBL23421161 0.78 CA1 (0.62) CA2CA1CA12CA9KMT2A
SCHEMBL29767882 0.78 CA1 (0.62) CA2CA1CA12CA9KMT2A
SCHEMBL26606068 0.78 LMNA (0.49) CA2CA1CA12CA9MEN1
SCHEMBL30090655 0.77 CA2 (1.00) CA2CA1CA12CA9MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4200139-A1 HEAT-SENSITIVE RECORDING MATERIAL, AND HEAT-SENSITIVE RECORDING LAYER AND COATING COMPOSITION FOR PRODUCING SAME, CORRESPONDING USES AND METHOD Mitsubishi HiTec Paper Europe GmbH (DE) 2023-06-28 EP disclosed
WO-2023100900-A1 THERMAL RECORDING COMPOSITION 日本化薬株式会社 2023-06-08 WO disclosed
WO-2022038242-A1 HEAT-SENSITIVE RECORDING MATERIAL, AND HEAT-SENSITIVE RECORDING LAYER AND COATING COMPOSITION FOR PRODUCING SAME, CORRESPONDING USES AND METHOD MITSUBISHI HITEC PAPER EUROPE GMBH (DE) 2022-02-24 WO disclosed
EP-3957488-A1 HEAT-SENSITIVE RECORDING MATERIAL AND HEAT-SENSITIVE RECORDING LAYER AND COATING COMPOSITION FOR ITS PRODUCTION, USES AND METHODS Mitsubishi HiTec Paper Europe GmbH (DE) 2022-02-23 EP disclosed
EP-3746309-A1 HEAT-SENSITIVE RECORDING MATERIAL Mitsubishi HiTec Paper Europe GmbH (DE) 2020-12-09 EP disclosed
EP-3523134-A1 HEAT-SENSITIVE RECORDING MATERIAL Mitsubishi HiTec Paper Europe GmbH (DE) 2019-08-14 EP disclosed