Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| 1-Propanethiol SCHEMBL23014019 | 1.00 | TSHR (0.35) | TSHRALDH1A1 | |
| 1-Propanethiol SCHEMBL21295487 | 0.88 | ALDH1A1 (0.32) | TSHRALDH1A1 | |
| Butane SCHEMBL20394152 | 0.82 | ALDH1A1 (0.41) | TSHRALDH1A1 | |
| Butane SCHEMBL967967 | 0.82 | ALDH1A1 (0.41) | TSHRALDH1A1 | |
| Propanol SCHEMBL854619 | 0.79 | ALDH1A1 (0.41) | TSHRALDH1A1 | |
| Propane SCHEMBL3395511 | 0.78 | TSHR (0.44) | TSHRALDH1A1 | |
| Alcohol SCHEMBL820597 | 0.78 | TSHR (0.55) | TSHRALDH1A1 | |
| Propane SCHEMBL14841763 | 0.78 | TSHR (0.44) | TSHRALDH1A1 | |
| Hexane SCHEMBL8941754 | 0.76 | SMN1; SMN2 (0.53) | TSHRALDH1A1 | |
| Hexane SCHEMBL20394309 | 0.76 | SMN1; SMN2 (0.53) | TSHRALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11834575-B2 | Epoxy resin composition | CANON KABUSHIKI KAISHA (JP) | 2023-12-05 | — | — | US | claimed |
| EP-4372030-A1 | CURABLE RESIN COMPOSITION | Namics Corporation (JP) | 2024-05-22 | — | — | EP | disclosed |
| EP-4372021-A1 | CURABLE RESIN COMPOSITION | Namics Corporation (JP) | 2024-05-22 | — | — | EP | disclosed |
| WO-2024089906-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT AND SEMICONDUCTOR DEVICE | NAMICS CORPORATION (JP) | 2024-05-02 | — | — | WO | disclosed |
| WO-2024089905-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT | NAMICS CORPORATION (JP) | 2024-05-02 | — | — | WO | disclosed |
| WO-2024090259-A1 | RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2024-05-02 | — | — | WO | disclosed |
| WO-2024048612-A1 | CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT | 株式会社クレハ | 2024-03-07 | — | — | WO | disclosed |
| WO-2024048585-A1 | RUBBER-BONDED CELLULOSE FIBERS AND MANUFACTURING METHOD THEREFOR, RESIN COMPOSITION AND MANUFACTURING METHOD THEREFOR, AND CURABLE RESIN COMPOSITION | 株式会社クレハ | 2024-03-07 | — | — | WO | disclosed |
| EP-4317234-A1 | CURABLE RESIN COMPOSITION | Namics Corporation (JP) | 2024-02-07 | — | — | EP | disclosed |
| WO-2024018730-A1 | COATING COMPOSITION AND IN-MOLD COATING METHOD | 関西ペイント株式会社 | 2024-01-25 | — | — | WO | disclosed |
| EP-4130094-A1 | CURING CATALYST, RESIN COMPOSITION, SEALING MATERIAL, ADHESIVE AND CURED PRODUCT | Namics Corporation (JP) | 2023-02-08 | — | — | EP | disclosed |
| EP-4130093-A1 | EPOXY AMINE ADDUCT, CURING CATALYST, RESIN COMPOSITION, SEALING MATERIAL, ADHESIVE AND CURED ARTICLE | Namics Corporation (JP) | 2023-02-08 | — | — | EP | disclosed |
| US-20210221964-A1 | METHOD FOR PRODUCING EPOXY RESIN COMPOSITION | CANON KABUSHIKI KAISHA (JP) | 2021-07-22 | — | — | US | disclosed |
| US-20210222000-A1 | EPOXY RESIN COMPOSITION | CANON KABUSHIKI KAISHA (JP) | 2021-07-22 | — | — | US | disclosed |
| US-20210108025-A1 | EPOXY RESIN COMPOSITION | NAMICS CORPORATION (JP) | 2021-04-15 | — | — | US | disclosed |
| WO-2021033327-A1 | EPOXY RESIN COMPOSITION | ナミックス株式会社 | 2021-02-25 | — | — | WO | disclosed |
| WO-2021033325-A1 | EPOXY RESIN COMPOSITION | ナミックス株式会社 | 2021-02-25 | — | — | WO | disclosed |
| WO-2021033329-A1 | EPOXY RESIN COMPOSITION | ナミックス株式会社 | 2021-02-25 | — | — | WO | disclosed |
| WO-2020217706-A1 | RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, AND PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL OBTAINED USING SAME | 堺化学工業株式会社 | 2020-10-29 | — | — | WO | disclosed |
| WO-2019163818-A1 | EPOXY RESIN COMPOSITION | ナミックス株式会社 | 2019-08-29 | — | — | WO | disclosed |