SCHEMBL213520

SCHEMBL213520

CCC1(COCc2ccccc2)COC1

nearest known ligand 0.45

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.45
TACR1 P25103 3/20 0.42
KMT2A Q03164 3/20 0.39
MEN1 O00255 2/20 0.39
CTSK P43235 1/20 0.36
NPSR1 Q6W5P4 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
POLB P06746 1/20 0.34
HSD17B10 Q99714 1/20 0.34
IDO1 P14902 1/20 0.34
TAAR1 Q96RJ0 1/20 0.34
LMNA P02545 1/20 0.34
MMP2 P08253 1/20 0.34
MMP3 P08254 1/20 0.34
MMP9 P14780 1/20 0.34
TP53 P04637 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28001128 0.92 TSHR (0.41) TSHRTACR1KMT2AMEN1CTSK
SCHEMBL36601 0.91 TSHR (0.38) TSHRTACR1KMT2AMEN1CTSK
SCHEMBL13824550 0.91 CHRM3 (0.39) TSHRTACR1KMT2AMEN1
SCHEMBL2035091 0.91 IDO1 (0.41) TSHRTACR1KMT2AMEN1CTSK
SCHEMBL13721129 0.90 TSHR (0.37) TSHRTACR1KMT2AMEN1CTSK
SCHEMBL3161401 0.90 TSHR (0.37) TSHRTACR1KMT2AMEN1CTSK
SCHEMBL8304761 0.90 TSHR (0.52) TSHRTACR1KMT2AMEN1NPSR1
SCHEMBL4232935 0.89 TSHR (0.43) TSHRTACR1KMT2AMEN1CTSK
SCHEMBL13320079 0.88 FAAH (0.36) TSHRTACR1KMT2AMEN1CTSK
SCHEMBL13028066 0.88 FAAH (0.36) TSHRTACR1KMT2AMEN1CTSK

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1226 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250066548-A1 HYBRID PHOTOCURABLE COMPOSITION ARKEMA FRANCE (FR) 2025-02-27 US claimed
CN-119463769-A Adhesive composition, wafer-level packaging structure, preparation method of wafer-level packaging structure and semiconductor device 上海玟昕科技有限公司 2025-02-18 CN claimed
CN-119350920-A Ultraviolet light curing epoxy encapsulation ink with high reliability and low moisture permeability and preparation method and application thereof 西安思摩威新材料有限公司 2025-01-24 CN claimed
CN-119320613-A UV-thermal dual-curing adhesive and preparation method and application thereof 杭州之江有机硅化工有限公司 2025-01-17 CN claimed
EP-4457565-A1 HYBRID PHOTOCURABLE COMPOSITION ARKEMA FRANCE (FR) 2024-11-06 EP claimed
CN-118901044-A Hybrid photocurable compositions 阿科玛法国公司 2024-11-05 CN claimed
CN-118546635-A LED packaging adhesive, preparation method and LED packaging method 北京康美特科技股份有限公司 2024-08-27 CN claimed
CN-118374248-A Photovoltaic module packaging resin composition and preparation method thereof 江苏泰特尔新材料科技股份有限公司 2024-07-23 CN claimed
CN-117946611-A Curable composition for encapsulating material and encapsulating material for organic light-emitting device comprising same 利诺士尖端材料有限公司 2024-04-30 CN claimed
CN-117264469-A Delayed-curing UV adhesive for inkjet printing 苏州凡赛特材料科技有限公司 2023-12-22 CN claimed
WO-2008110512-A1 PHOTOCURABLE COMPOSITIONS FOR PREPARING ABS-LIKE ARTICLES HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) 2008-09-18 WO claimed
US-7183040-B2 Radiation curable resin composition and rapid prototyping process using the same DSM IP ASSETS B.V. (NL) 2007-02-27 US claimed
US-6866376-B2 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink BROTHER KOGYO KABUSHIKI KAISHA (JP) 2005-03-15 US claimed
EP-1502155-A1 RADIATION CURABLE RESIN COMPOSITION AND RAPID PROTOTYPING PROCESS USING THE SAME DSM IP Assets B.V. (NL) 2005-02-02 EP claimed
US-20040142274-A1 Radiation curable resin composition and rapid prototyping process using the same STRATASYS INC. 2004-07-22 US claimed
WO-2003093901-A1 RADIATION CURABLE RESIN COMPOSITION AND RAPID PROTOTYPING PROCESS USING THE SAME DSM IP ASSETS B.V. (NL) 2003-11-13 WO claimed
US-6498200-B1 OXIRANE OR OXETANE RING COMPOUND, ORGANIC PEROXIDE, ONIUM SALT CATALYST, AND ALKALINE FILLER; CURES RAPIDLY; STABLE DOES NOT CAUSE INCREASE IN ELECTROCONDUCTIVITY OR CORROSION; SEALANT, BINDER, ENCAPSULATING AGENT, DIELECTRIC FILM NAMICS CORPORATION (JP) 2002-12-24 US claimed
EP-0848294-B1 Photo-curable resin composition used for photo-fabrication of three-dimensional objects DSM NV (NL) 2001-09-19 EP claimed
US-5981616-A OXETANE COMPOUND, EPOXY COMPOUND CONSISTING OF EXPOXIDIZED POLYMERS OF CONJUGATED DIENE MONOMERS, EXPOXIDIZED COPOLYMERS OF DIENE MONOMERS AND COMPOUNDS HAVING AN ETHYLENICALLY UNSATURATED BOND, AND EXPOXIDIZED NATURAL RUBBER DSM N.V. (NL) 1999-11-09 US claimed
EP-0848294-A1 Photo-curable resin composition used for photo-fabrication of three-dimensional objects DSM N.V. (NL) 1998-06-17 EP claimed