SCHEMBL2137799

SCHEMBL2137799

[Cu+2].[Cu+2].[Cu+2].[Cu+2].[Cu+2].[Cu+2].[Cu+2].[Cu+2].[Cu+2].[O-][Si]([O-])([O-])F.[O-][Si]([O-])([O-])F.[O-][Si]([O-])([O-])F.[O-][Si]([O-])([O-])F.[O-][Si]([O-])([O-])F.[O-][Si]([O-])([O-])F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21066112 1.00
Water SCHEMBL5161689 0.94
SCHEMBL6704187 0.86
SCHEMBL10457716 0.86
SCHEMBL221506 0.86
SCHEMBL3914625 0.86
SCHEMBL322421 0.86
SCHEMBL21646130 0.86
SCHEMBL982831 0.86
Silver SCHEMBL4167944 0.86

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 108 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122057451-A CO (carbon monoxide)2Preparation method of graded porous MOF nanofiber aerogel for trapping 东华大学 2026-05-19 CN claimed
CN-119285982-A Flexible metal organic framework material with molecular sieve-like performance, and preparation method and application thereof 浙江工业大学 2025-01-10 CN claimed
CN-119183350-A Multicomponent fungicides 安道麦马克西姆有限公司 2024-12-24 CN claimed
CN-118591294-A Combinations of copper-based fungicides and azole fungicides 安道麦马克西姆有限公司 2024-09-03 CN claimed
CN-115678024-B Fluorosilicate MOF material and preparation method and application thereof 浙江工业大学 2023-07-25 CN claimed
CN-115678024-A Fluorosilicate MOF material and preparation method and application thereof 浙江工业大学 2023-02-03 CN claimed
CN-113233446-B Preparation method of graphene heat-conducting film and graphene heat-conducting film prepared by same 山东海科创新研究院有限公司 2022-08-23 CN claimed
CN-112473625-B Preparation method of ultra-microporous metal organic framework material for separating acetylene and ethylene 杭州市富阳区浙工大银湖创新创业研究院 2022-05-20 CN claimed
CN-110818908-B Preparation method of metal organic framework material for detecting oxidizing gas 杭州市富阳区浙工大银湖创新创业研究院 2021-12-17 CN claimed
CN-113233446-A Preparation method of graphene heat-conducting film and graphene heat-conducting film prepared by same 山东海科创新研究院有限公司 2021-08-10 CN claimed
EP-3837068-A2 THIN COPPER FLAKES FOR CONDUCTIVE INKS YISSUM RESEARCH DEVELOPMENT COMPANY OF THE HEBREW UNIVERSITY OF JERUSALEM LTD (IL) 2021-06-23 EP claimed
CN-112473625-A Preparation method of ultra-microporous metal organic framework material for separating acetylene and ethylene 杭州市富阳区浙工大银湖创新创业研究院 2021-03-12 CN claimed
CN-112295550-A Fluorosilicate porous hybrid material, and preparation method and application thereof 浙江工业大学 2021-02-02 CN claimed
CN-110818908-A Preparation method of metal organic framework material for detecting oxidizing gas 杭州市富阳区浙工大银湖创新创业研究院 2020-02-21 CN claimed
EP-1976388-A1 ANTIMICROBIAL SOLUTION COMPRISING A METALLIC SALT AND A SURFACTANT CTT GROUP INC. (CA) 2008-10-08 EP claimed
WO-2006105669-A1 ANTIMICROBIAL SOLUTION COMPRISING A METALLIC SALT AND A SURFACTANT CTT GROUP INC. (CA) 2006-10-12 WO claimed
US-20040211673-A1 Electroplating a copper thin film on the copper seed layer by using an aqueous solution of 10 to 40 wt % of copper hexafluorosilicate as an electrolyte for forming a semiconductor integrated circuit having a copper seed layer MORITA CHEMICAL INDUSTRIES CO., LTD. 2004-10-28 US claimed
US-20030111354-A1 10-40 wt % of copper hexafluorosilicate and is used as an electrolyte MORITA CHEMICAL INDUSTRIES CO., LTD. (JP) 2003-06-19 US claimed
EP-0393306-B1 Water soluble wood preservative and its use in pressure and/or vacuum impregnation or immersion processes DESOWAG MATERIALSCHUTZ GMBH (DE) 1994-09-14 EP claimed
JP-2295702-A None JP disclosed
CN-122057451-A CO (carbon monoxide)2Preparation method of graded porous MOF nanofiber aerogel for trapping 东华大学 2026-05-19 CN disclosed
CN-119285982-B Flexible metal organic framework material with molecular sieve-like performance, and preparation method and application thereof 浙江工业大学 2026-01-27 CN disclosed
CN-119570055-A Inorganic fluorine-containing anion functionalized microporous material, and preparation method and application thereof 浙江大学 2025-03-07 CN disclosed
CN-119562764-A Azole fungicide composition 安道麦马克西姆有限公司 2025-03-04 CN disclosed
CN-119285982-A Flexible metal organic framework material with molecular sieve-like performance, and preparation method and application thereof 浙江工业大学 2025-01-10 CN disclosed
CN-119285982-A Flexible metal organic framework material with molecular sieve-like performance, and preparation method and application thereof 浙江工业大学 2025-01-10 CN disclosed
CN-119183350-A Multicomponent fungicides 安道麦马克西姆有限公司 2024-12-24 CN disclosed
CN-118930884-A Fluorine-containing metal organic framework material for methane and nitrogen separation, and preparation method and application thereof 浙江工业大学 2024-11-12 CN disclosed
CN-118591294-A Combinations of copper-based fungicides and azole fungicides 安道麦马克西姆有限公司 2024-09-03 CN disclosed
US-20240269739-A1 NANOHYBRID AND NANOCOMPOSITE COMPOSITIONS AND METHODS FOR MAKING AND USING SAME P&S GLOBAL HOLDINGS LLC (US) 2024-08-15 US disclosed
CN-115873263-B Metal organic framework material and preparation method and application thereof 山东能源集团有限公司 2023-09-15 CN disclosed
WO-2023172363-A1 NANOHYBRID AND NANOCOMPOSITE COMPOSITIONS AND METHODS FOR MAKING AND USING SAME P&S GLOBAL HOLDINGS LLC (US) 2023-09-14 WO disclosed
CN-116709923-A Copper-based fungicide composition 阿达玛马克西姆有限公司 2023-09-05 CN disclosed
CN-115379605-B Graphene heating film, component, system and temperature control method 温州众合绿材科技有限公司 2023-07-25 CN disclosed
CN-115678024-B Fluorosilicate MOF material and preparation method and application thereof 浙江工业大学 2023-07-25 CN disclosed
CN-116347986-A Formulations of copper-based fungicides and bactericides 阿达玛马克西姆有限公司 2023-06-27 CN disclosed
CN-114573829-B Metal organic framework material and preparation method and application thereof 北京化工大学 2023-04-21 CN disclosed
CN-115873263-A Metal organic framework material and preparation method and application thereof 山东能源集团有限公司 2023-03-31 CN disclosed
CN-115678024-A Fluorosilicate MOF material and preparation method and application thereof 浙江工业大学 2023-02-03 CN disclosed
CN-115379605-A Graphene heating film, assembly, system and temperature control method 温州众合绿材科技有限公司 2022-11-22 CN disclosed
CN-113233446-B Preparation method of graphene heat-conducting film and graphene heat-conducting film prepared by same 山东海科创新研究院有限公司 2022-08-23 CN disclosed
CN-114573829-A Metal organic framework material and preparation method and application thereof 北京化工大学 2022-06-03 CN disclosed
CN-112473625-B Preparation method of ultra-microporous metal organic framework material for separating acetylene and ethylene 杭州市富阳区浙工大银湖创新创业研究院 2022-05-20 CN disclosed
CN-112473625-B Preparation method of ultra-microporous metal organic framework material for separating acetylene and ethylene 杭州市富阳区浙工大银湖创新创业研究院 2022-05-20 CN disclosed
US-20220105467-A1 PRECIPITATION SYSTEM AND PRECIPITATION METHOD TOYOBO CO., LTD. (JP) 2022-04-07 US disclosed
CN-110818908-B Preparation method of metal organic framework material for detecting oxidizing gas 杭州市富阳区浙工大银湖创新创业研究院 2021-12-17 CN disclosed
CN-113453776-A Precipitation system and precipitation method 东洋纺株式会社 2021-09-28 CN disclosed
CN-113233446-A Preparation method of graphene heat-conducting film and graphene heat-conducting film prepared by same 山东海科创新研究院有限公司 2021-08-10 CN disclosed
EP-3837068-A2 THIN COPPER FLAKES FOR CONDUCTIVE INKS YISSUM RESEARCH DEVELOPMENT COMPANY OF THE HEBREW UNIVERSITY OF JERUSALEM LTD (IL) 2021-06-23 EP disclosed
CN-112473625-A Preparation method of ultra-microporous metal organic framework material for separating acetylene and ethylene 杭州市富阳区浙工大银湖创新创业研究院 2021-03-12 CN disclosed
CN-112473625-A Preparation method of ultra-microporous metal organic framework material for separating acetylene and ethylene 杭州市富阳区浙工大银湖创新创业研究院 2021-03-12 CN disclosed
CN-112295550-A Fluorosilicate porous hybrid material, and preparation method and application thereof 浙江工业大学 2021-02-02 CN disclosed
CN-112295550-A Fluorosilicate porous hybrid material, and preparation method and application thereof 浙江工业大学 2021-02-02 CN disclosed
CN-110818908-A Preparation method of metal organic framework material for detecting oxidizing gas 杭州市富阳区浙工大银湖创新创业研究院 2020-02-21 CN disclosed
EP-2231903-B1 METHOD FOR APPLYING COMPOSITE COATINGS FOR WHISKER REDUCTION MACDERMID ENTHONE INC (US) 2019-02-20 EP disclosed
EP-3047924-B1 NICKEL BALL, NICKEL CORE BALL, SOLDER JOINT, FOAM SOLDER AND SOLDER PASTE SENJU METAL INDUSTRY CO (JP) 2018-08-22 EP disclosed
US-9816160-B2 Ni ball, Ni nuclear ball, solder joint, foam solder and solder paste SENJU METAL INDUSTRY CO., LTD. (JP) 2017-11-14 US disclosed
US-20160304992-A1 Ni Ball, Ni Nuclear Ball, Solder Joint, Foam Solder and Solder Paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-10-20 US disclosed
EP-3047924-A1 Ni BALL, Ni NUCLEAR BALL, SOLDER JOINT, FOAM SOLDER AND SOLDER PASTE Senju Metal Industry Co., Ltd (JP) 2016-07-27 EP disclosed
US-20150201622-A1 NEW ANTIMICROBIAL COMPOSITIONS AND USES THEREOF CTT GROUP INC (CA) 2015-07-23 US disclosed
US-8906217-B2 Composite coatings for whisker reduction ENTHONE INC. (US) 2014-12-09 US disclosed
EP-1911516-B1 HOMOGENEOUS ASYMMETRIC HYDROGENATION PROCESS TAKASAGO PERFUMERY CO LTD (JP) 2014-05-14 EP disclosed
EP-2392400-B1 Homogeneous asymmetric hydrogenation method TAKASAGO PERFUMERY CO LTD (JP) 2014-05-07 EP disclosed
US-8586498-B2 Homogeneous asymmetric hydrogenation catalyst TAKASAGO INTERNATIONAL CORPORATION (JP) 2013-11-19 US disclosed
US-8497400-B2 Homogeneous asymmetric hydrogenation process TAKASAGO INTERNATIONAL CORPORATION (JP) 2013-07-30 US disclosed
US-8481791-B2 Homogeneous asymmetric hydrogenation process TAKASAGO INTERNATIONAL CORPORATION (JP) 2013-07-09 US disclosed
US-20120285834-A1 COMPOSITE COATINGS FOR WHISKER REDUCTION ENTHONE INC. (US) 2012-11-15 US disclosed
US-8226807-B2 Composite coatings for whisker reduction ENTHONE INC. (US) 2012-07-24 US disclosed
EP-2392400-A2 Homogeneous asymmetric hydrogenation catalyst Takasago International Corporation (JP) 2011-12-07 EP disclosed
US-20110065929-A1 HOMOGENEOUS ASYMMETRIC HYDROGENATION CATALYST TAKASAGO INTERNATIONAL CORPORATION (JP) 2011-03-17 US disclosed
US-7902110-B2 Homogeneous asymmetric hydrogenation catalyst TAKASAGO INTERNATIONAL CORPORATION (JP) 2011-03-08 US disclosed
EP-2231903-A1 COMPOSITE COATINGS FOR WHISKER REDUCTION Enthone, Inc. (US) 2010-09-29 EP disclosed
US-20100168440-A1 Homogeneous Asymmetric Hydrogenation Process TAKASAGO INTERNATIONAL CORPORATION (JP) 2010-07-01 US disclosed
US-20100137615-A1 Homogeneous Asymmetric Hydrogenation Process TAKASAGO INTERNATIONAL CORPORATION (JP) 2010-06-03 US disclosed
EP-2095875-A1 Homogeneous asymmetric hydrogenation catalyst Takasago International Corporation (JP) 2009-09-02 EP disclosed
US-20090203927-A1 Homogeneous asymmetric hydrogenation catalyst TAKASAGO INTERNATIONAL CORPORATION (JP) 2009-08-13 US disclosed
WO-2009076424-A1 COMPOSITE COATINGS FOR WHISKER REDUCTION ENTHONE INC. (US) 2009-06-18 WO disclosed
US-20090145764-A1 COMPOSITE COATINGS FOR WHISKER REDUCTION ENTHONE INC. (US) 2009-06-11 US disclosed
US-20090145765-A1 COMPOSITE COATINGS FOR WHISKER REDUCTION ENTHONE INC. (US) 2009-06-11 US disclosed
EP-1976388-A1 ANTIMICROBIAL SOLUTION COMPRISING A METALLIC SALT AND A SURFACTANT CTT GROUP INC. (CA) 2008-10-08 EP disclosed
US-7422793-B2 Non-toxic corrosion-protection rinses and seals based on rare earth elements UNIVERSITY OF DAYTON (US) 2008-09-09 US disclosed
US-20080199502-A1 Antimicrobial Solution Comprising a Metallic Salt and a Surfactant CTT GROUP INC. (CA) 2008-08-21 US disclosed
US-7407711-B2 Non-toxic corrosion-protection conversion coats based on rare earth elements UNIVERSITY OF DAYTON (US) 2008-08-05 US disclosed
EP-1911516-A1 HOMOGENEOUS ASYMMETRIC HYDROGENATION CATALYST Takasago International Corporation (JP) 2008-04-16 EP disclosed
US-20080008945-A1 TONER, TONER PRODUCING METHOD AND IMAGE FORMING METHOD KONICA MINOLTA BUSINESS TECHNOLOGIES, INC. (JP) 2008-01-10 US disclosed
US-7303846-B2 Electrophotographic toner, process for producing the same, and process for forming image FUJI XEROX CO., LTD. (JP) 2007-12-04 US disclosed
US-7294211-B2 Non-toxic corrosion-protection conversion coats based on cobalt UNIVERSITY OF DAYTON (US) 2007-11-13 US disclosed
US-7273540-B2 Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film SHINRYO ELECTRONICS CO., LTD. (JP) 2007-09-25 US disclosed
US-7235142-B2 Non-toxic corrosion-protection rinses and seals based on cobalt UNIVERSITY OF DAYTON (US) 2007-06-26 US disclosed
WO-2006105669-A1 ANTIMICROBIAL SOLUTION COMPRISING A METALLIC SALT AND A SURFACTANT CTT GROUP INC. (CA) 2006-10-12 WO disclosed
US-20060046173-A1 Electrophotographic toner, process for producing the same, and process for forming image FUJI XEROX CO., LTD. (JP) 2006-03-02 US disclosed
US-20050184369-A1 Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film SINRYO ELECTRONICS CO., LTD. (JP) 2005-08-25 US disclosed
EP-1553211-A1 TIN-SILVER-COPPER PLATING SOLUTION, PLATING FILM CONTAINING THE SAME, AND METHOD FOR FORMING THE PLATING FILM SHINRYO ELECTRONICS CO., LTD. (JP) 2005-07-13 EP disclosed
US-6911473-B2 Detectable agent for wood treatment and method for its detection NUTRINOVA NUTRITION SPECIALTIES & FOOD INGREDIENTS GMBH (DE) 2005-06-28 US disclosed
US-20040211673-A1 Electroplating a copper thin film on the copper seed layer by using an aqueous solution of 10 to 40 wt % of copper hexafluorosilicate as an electrolyte for forming a semiconductor integrated circuit having a copper seed layer MORITA CHEMICAL INDUSTRIES CO., LTD. 2004-10-28 US disclosed
US-20040211673-A1 Electroplating a copper thin film on the copper seed layer by using an aqueous solution of 10 to 40 wt % of copper hexafluorosilicate as an electrolyte for forming a semiconductor integrated circuit having a copper seed layer MORITA CHEMICAL INDUSTRIES CO., LTD. 2004-10-28 US disclosed
US-20040166781-A1 Composition for texturing process SHOWA DENKO K.K. (JP) 2004-08-26 US disclosed
US-20030232885-A1 Detectable agent for wood treatment and method for its detection NUTRINOVA NUTRITION SPECIALTIES & FOOD INGREDIENTS GMBH (DE) 2003-12-18 US disclosed
US-6652921-B2 Wood containing fixed sorbic acid or sorbic acid salts NUTRINOVA NUTRITION SPECIALTIES & FOOD INGREDIENTS GMBH (DE) 2003-11-25 US disclosed
EP-1086484-A4 SLURRY FOR CHEMICAL-MECHANICAL POLISHING METAL SURFACES FERRO CORP (US) 2003-08-06 EP disclosed
US-20030111354-A1 10-40 wt % of copper hexafluorosilicate and is used as an electrolyte MORITA CHEMICAL INDUSTRIES CO., LTD. (JP) 2003-06-19 US disclosed
US-20030111354-A1 10-40 wt % of copper hexafluorosilicate and is used as an electrolyte MORITA CHEMICAL INDUSTRIES CO., LTD. (JP) 2003-06-19 US disclosed
WO-2002076902-A1 COMPOSITION FOR TEXTURING PROCESS SHOWA DENKO K.K. (JP) 2002-10-03 WO disclosed
US-20020110677-A1 Dielectric properties, density, uniformity, thermal and oxygen stability NUTRINOVA NUTRITION SPECIALTIES & FOOD INGREDIENTS GMBH (DE) 2002-08-15 US disclosed
EP-1086484-A1 SLURRY FOR CHEMICAL-MECHANICAL POLISHING METAL SURFACES FERRO CORPORATION (US) 2001-03-28 EP disclosed
WO-1999053532-A1 SLURRY FOR CHEMICAL-MECHANICAL POLISHING METAL SURFACES FERRO CORPORATION (US) 1999-10-21 WO disclosed
JP-H02295702-A WATER SOLUBLE TIMBER PROTECTIVE AGENT AND METHOD FOR DIPPING TIMBER OR WOODY MATERIAL DESOWAG MATERIALSCHUTZ GMBH 1990-12-06 JP disclosed
US-4973360-A Sealant for the cooling system of automotive and other engines MIRACLE MECHANICS, INC. (US) 1990-11-27 US disclosed
US-4973360-A Sealant for the cooling system of automotive and other engines MIRACLE MECHANICS, INC. (US) 1990-11-27 US disclosed