SCHEMBL2139673

SCHEMBL2139673

[CH2]CC1(CC)CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL179683 0.81
SCHEMBL2785699 0.78
SCHEMBL28282111 0.78
SCHEMBL4144183 0.72
SCHEMBL5500422 0.71
SCHEMBL1467145 0.71
SCHEMBL7054256 0.71
SCHEMBL18431793 0.71
SCHEMBL7388302 0.71
SCHEMBL27900708 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117425857-A Photosensitive composition, cured film using same, color filter, optical filter, image display device, solid-state imaging element, and infrared sensor 东洋油墨SC控股株式会社 2024-01-19 CN disclosed
WO-2023038092-A1 PHOTOSENSITIVE COMPOSITION, CURED FILM OBTAINED THEREFROM, COLOR FILTER, OPTICAL FILTER, IMAGE DISPLAY DEVICE, SOLID IMAGING ELEMENT, AND INFRARED SENSOR 東洋インキSCホールディングス株式会社 2023-03-16 WO disclosed
WO-2021132631-A1 THERMALLY CURABLE HARDCOAT AGENT, LAYERED FILM, AND DECORATED MOLDED OBJECT 東洋インキSCホールディングス株式会社 2021-07-01 WO disclosed
EP-3438135-B1 PHOTOCURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME OSAKA SODA CO LTD (JP) 2020-09-23 EP disclosed
CN-107614554-B Organic-inorganic composite 日本曹达株式会社 2020-07-17 CN disclosed
CN-107112366-B Organic thin film transistor 日本曹达株式会社 2020-07-10 CN disclosed
EP-3674272-A1 COATING MATERIAL FOR OPTICAL FIBER, COATED OPTICAL FIBER, AND METHOD FOR PRODUCING COATED OPTICAL FIBER FURUKAWA ELECTRIC CO., LTD. (JP) 2020-07-01 EP disclosed
US-20200181417-A1 COATING MATERIAL FOR OPTICAL FIBER, COATED OPTICAL FIBER, AND MANUFACTURING METHOD OF COATED OPTICAL FIBER FURUKAWA ELECTRIC CO., LTD. (JP) 2020-06-11 US disclosed
US-10604600-B2 Photocurable resin composition and cured product of same OSAKA SODA CO., LTD. (JP) 2020-03-31 US disclosed
CN-106463408-B Organic semiconductor device 日本曹达株式会社 2019-09-03 CN disclosed
US-20060131267-A1 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG DISPLAY CO., LTD. (KR) 2006-06-22 US disclosed
US-6797450-B2 ALKALI-SOLUBLE RESIN HAVING NO EPOXY GROUP AND A 1,2-QUINONEDIAZIDE COMPOUND JSR CORPORATION (JP) 2004-09-28 US disclosed
US-6756165-B2 ALKALI SOLUBLE RESIN, UNSATURATED POLYMERIZABLE COMPOUND, RADIATION SENSITIVE POLYMERIZATION INITIATOR JSR CORPORATION (JP) 2004-06-29 US disclosed
EP-1057859-B1 Radiation sensitive resin composition and use of the same in an interlaminar insulating film JSR CORP (JP) 2004-05-19 EP disclosed
EP-1312982-A1 RADIATION-SENSITIVE COMPOSITION, INSULATING FILM AND ORGANIC EL DISPLAY ELEMENT JSR Corporation (JP) 2003-05-21 EP disclosed
US-20030054284-A1 Radiation-sensitive composition, insulating film and organic el display element JSR CORPORATION (JP) 2003-03-20 US disclosed
US-6399267-B1 COPOLYMER CONTAINING UNSATURATED CARBOXY ACID OR ANHYDRIDE AND MONOMER OF EPOXY CONTAINING ACRYLIC ESTER JSR CORPORATION (JP) 2002-06-04 US disclosed
US-20010044075-A1 Radiation sensitive resin composition for forming barrier ribs for an EL display element, barrier rib and EL display element JSR CORPORATION (JP) 2001-11-22 US disclosed
EP-1150165-A1 Radiation sensitive resin composition for forming barrier ribs for an el display element, barrier ribs and el display element JSR Corporation (JP) 2001-10-31 EP disclosed
EP-1057859-A2 Radiation sensitive resin composition and use of the same in an interlaminar insulating film JSR Corporation (JP) 2000-12-06 EP disclosed