SCHEMBL21409652

SCHEMBL21409652

CCC(O)CC1CCCC1

nearest known ligand 0.44

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
SHBG P04278 1/20 0.37
ALDH1A1 P00352 1/20 0.36
KMT2A Q03164 1/20 0.36
CYP1A2 P05177 1/20 0.36
METAP2 P50579 1/20 0.35
KDM4E B2RXH2 1/20 0.33
REN P00797 2/20 0.33
ATM Q13315 1/20 0.33
IDO1 P14902 1/20 0.33
TDO2 P48775 1/20 0.33
NOS1 P29475 1/20 0.32
NOS2 P35228 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1105462 1.00 SHBG (0.37) SHBGALDH1A1KMT2ACYP1A2METAP2
SCHEMBL6145227 0.98 SHBG (0.41) SHBGALDH1A1KMT2ACYP1A2METAP2
SCHEMBL6662787 0.98 SHBG (0.41) SHBGALDH1A1KMT2ACYP1A2METAP2
SCHEMBL5470740 0.90
SCHEMBL26668524 0.90 TSHR (0.33) SHBG
SCHEMBL20354169 0.81 KDM4E (0.42) KDM4EIDO1
SCHEMBL8338960 0.81 IDO1 (0.33) KMT2AIDO1TDO2
SCHEMBL6985349 0.81 ALDH1A1 (0.41) ALDH1A1KMT2ACYP1A2METAP2KDM4E
SCHEMBL26668509 0.80 TSHR (0.30) SHBG
SCHEMBL14402446 0.79 ALDH1A1 (0.43) ALDH1A1KMT2ACYP1A2METAP2KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113853304-B Reactive adhesive, laminated film, and package DIC株式会社 2024-02-13 CN disclosed
CN-117043224-A Process for producing modified polyester resin DIC株式会社 2023-11-10 CN disclosed
CN-113165357-B Reactive adhesive, laminate, and package DIC株式会社 2023-03-28 CN disclosed
CN-111902512-B Reactive adhesive, laminated film, and package DIC株式会社 2022-09-13 CN disclosed
CN-113853304-A Reactive adhesive, laminated film, and package DIC株式会社 2021-12-28 CN disclosed
CN-113165357-A Reactive adhesive, laminate, and package DIC株式会社 2021-07-23 CN disclosed
WO-2020246241-A1 REACTIVE ADHESIVE AGENT, LAMINATED FILM, AND PACKAGING BODY DIC株式会社 2020-12-10 WO disclosed
CN-111902512-A Reactive adhesive, laminated film, and package DIC株式会社 2020-11-06 CN disclosed
WO-2019188335-A1 REACTIVE ADHESIVE AGENT, LAMINATE FILM, AND PACKAGING BODY DIC株式会社 2019-10-03 WO disclosed