SCHEMBL21409939

SCHEMBL21409939

C=CCOC(=O)/C=C(/C)C(=O)OCC=C

nearest known ligand 0.42

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.42
CACNA1B Q00975 1/20 0.42
APBA1 Q02410 1/20 0.42
TSHR P16473 4/20 0.38
MEN1 O00255 2/20 0.38
KMT2A Q03164 2/20 0.38
CYP3A4 P08684 1/20 0.36
NPSR1 Q6W5P4 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
APP P05067 1/20 0.35
PTP4A3 O75365 2/20 0.32
PTP4A1 Q93096 2/20 0.32
PTP4A2 Q12974 1/20 0.32
ALDH1A1 P00352 2/20 0.32
HSD17B10 Q99714 1/20 0.32
HPGD P15428 1/20 0.31
MAPK1 P28482 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1075821 0.84 TSHR (0.38) MAPTCACNA1BAPBA1TSHRMEN1
SCHEMBL1075819 0.84 TSHR (0.38) MAPTCACNA1BAPBA1TSHRMEN1
SCHEMBL1075820 0.84 MAPT (0.42) MAPTCACNA1BAPBA1TSHRMEN1
SCHEMBL6050174 0.81 MAPT (0.46) MAPTCACNA1BAPBA1TSHRCYP3A4
SCHEMBL45287 0.81 TSHR (0.41) MAPTCACNA1BAPBA1TSHRMEN1
SCHEMBL524629 0.81 TSHR (0.41) MAPTCACNA1BAPBA1TSHRMEN1
SCHEMBL9241885 0.81 TSHR (0.41) MAPTCACNA1BAPBA1TSHRMEN1
SCHEMBL175302 0.79 TSHR (0.40) MAPTCACNA1BAPBA1TSHRMEN1
SCHEMBL9491841 0.78 MAPT (0.41) MAPTCACNA1BAPBA1TSHRCYP3A4
SCHEMBL9491837 0.78 MAPT (0.41) MAPTCACNA1BAPBA1TSHRCYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2019189628-A1 THERMOSETTING RESIN COMPOSITION 株式会社大阪ソーダ 2019-10-03 WO claimed
EP-4023716-A1 TWO-COMPONENT-TYPE RESIN COMPOSITION FOR HEAT-RADIATING MATERIAL Nippon Shokubai Co., Ltd. (JP) 2022-07-06 EP disclosed
WO-2021039749-A1 TWO-COMPONENT-TYPE RESIN COMPOSITION FOR HEAT-RADIATING MATERIAL 株式会社日本触媒 2021-03-04 WO disclosed
WO-2019189628-A1 THERMOSETTING RESIN COMPOSITION 株式会社大阪ソーダ 2019-10-03 WO disclosed
CN-1257243-C Co-extrusion adhesive using cograft metallocene polyethylene as main component ATOFINA (FR) 2006-05-24 CN disclosed
CN-1082945-A Weak-acid cation-exchange resin INST OF HIGH MOLECULAR CHEMIST (CN) 1994-03-02 CN disclosed