SCHEMBL215442

SCHEMBL215442

CCC1(COCCOC2CC3CCC2(C)C3(C)C)COC1

nearest known ligand 0.43

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.43
KDM4E B2RXH2 2/20 0.43
ALDH1A1 P00352 2/20 0.41
LMNA P02545 5/20 0.41
HTT P42858 4/20 0.41
MAPT P10636 3/20 0.40
MEN1 O00255 3/20 0.40
NPSR1 Q6W5P4 2/20 0.40
PLA2G1B P04054 1/20 0.40
MAPK1 P28482 1/20 0.40
RAD52 P43351 1/20 0.40
ATG4B Q9Y4P1 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL214045 0.89 ALDH1A1 (0.45) KMT2AKDM4EALDH1A1LMNAHTT
SCHEMBL5824224 0.80 ALDH1A1 (0.54) KMT2AKDM4EALDH1A1LMNAHTT
SCHEMBL5824294 0.80 ALDH1A1 (0.54) KMT2AKDM4EALDH1A1LMNAHTT
SCHEMBL7688059 0.80 ALDH1A1 (0.56) KMT2AKDM4EALDH1A1LMNAHTT
SCHEMBL28994949 0.75 ALDH1A1 (0.43) KMT2AKDM4EALDH1A1LMNAHTT
SCHEMBL7689239 0.74 KMT2A (0.49) KMT2AKDM4EALDH1A1LMNAHTT
SCHEMBL7686932 0.74 KMT2A (0.49) KMT2AKDM4EALDH1A1LMNAHTT
SCHEMBL213172 0.73 TSHR (0.34) KMT2AMEN1
SCHEMBL28007809 0.73 LMNA (0.60) KMT2AKDM4EALDH1A1LMNAHTT
SCHEMBL75298 0.72 ALDH1A1 (0.55) KMT2AKDM4EALDH1A1LMNAHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 160 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230364928-A1 INKJET INK, METHOD FOR MANUFACTURING PRINTED MATERIAL, AND PRINTED MATERIAL NATOCO CO., LTD. (JP) 2023-11-16 US disclosed
US-20220389268-A1 INK-JET APPLICATION TYPE COMPOSITION FOR WIRING-LINE PROTECTION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING SAME, AND SEMICONDUCTOR DEVICE MITSUI CHEMICALS, INC. (JP) 2022-12-08 US disclosed
US-20220186066-A1 PROTECTION MEMBER FOR SEMICONDUCTOR, PROTECTION COMPOSITION FOR INKJET COATING-TYPE SEMICONDUCTOR, AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS USING SAME, AND SEMICONDUCTOR APPARATUS MITSUI CHEMICALS, INC. (JP) 2022-06-16 US disclosed
EP-3885399-A1 CURABLE COMPOSITION FOR MECHANICAL FOAMING, AND METHOD FOR MANUFACTURING FOAM OF SAME ThreeBond Co., Ltd. (JP) 2021-09-29 EP disclosed
US-20210237484-A1 METHOD FOR PRODUCING INKJET PRINTED MATERIAL AND INKJET PRINTED MATERIAL NATOCO CO., LTD. (JP) 2021-08-05 US disclosed
US-10982120-B2 Thermocurable electroconductive adhesive THREEBOND CO., LTD. (JP) 2021-04-20 US disclosed
EP-3199520-B1 SULFONIUM SALT, PHOTOACID GENERATOR, AND PHOTOSENSITIVE COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2019-12-25 EP disclosed
US-10386721-B2 Pattern formation method and electronic device manufactured using same ADEKA CORPORATION (JP) 2019-08-20 US disclosed
EP-3272737-B1 SULFONIC ACID DERIVATIVE COMPOUND, PHOTOACID GENERATOR, RESIST COMPOSITION, CATIONIC POLYMERIZATION INITIATOR, AND CATIONICALLY POLYMERIZABLE COMPOSITION ADEKA CORP (JP) 2019-07-24 EP disclosed
EP-2524914-B1 SULFONIC ACID DERIVATIVE COMPOUND AND NAPHTHALIC ACID DERIVATIVE COMPOUND ADEKA CORP (JP) 2019-07-03 EP disclosed
WO-2006098676-A1 ULTRAVIOLET CURING RESIN COMPOSITION PERSTORP SPECIALTY CHEMICALS AB (SE) 2006-09-21 WO disclosed
US-20060194029-A1 Ink composition, inkjet recording method using the same, and printed material FUJI PHOTO FILM CO., LTD. 2006-08-31 US disclosed
US-20060171627-A1 Optical device and method for producing the same BRIDGESTONE CORPORATION 2006-08-03 US disclosed
US-20050287470-A1 Curable compositions and rapid prototyping process using the same DSM IP ASSETS B.V. (NL) 2005-12-29 US disclosed
US-20050171255-A1 Resin composition for photofabrication of three dimensional objects YAMAMURA TETSUYA (JP) 2005-08-04 US disclosed
US-6866376-B2 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink BROTHER KOGYO KABUSHIKI KAISHA (JP) 2005-03-15 US disclosed
US-6805439-B2 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink BROTHER KOGYO KABUSHIKI KAISHA (JP) 2004-10-19 US disclosed
US-6586496-B1 Composition comprising compound having at least one oxetane ring, photoinitiator for cationic polymerization, silane coupling agent, microparticulate inorganic filler, and compound having epoxy group, having specified viscosity MITSUI CHEMICALS, INC. (JP) 2003-07-01 US disclosed
US-20030112307-A1 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink BROTHER KOGYO KABUSHIKI KAISHA (JP) 2003-06-19 US disclosed
US-20020132872-A1 Resin composition for photofabrication of three dimensional objects DSM IP ASSETS B.V. (NL) 2002-09-19 US disclosed