Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.59 |
| ▸ | CASP1 | P29466 | 1/20 | 0.41 |
| ▸ | HRH4 | Q9H3N8 | 1/20 | 0.33 |
| ▸ | RPS6KB1 | P23443 | 1/20 | 0.31 |
| ▸ | GSK3B | P49841 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2157582 | 0.82 | TSHR (0.51) | TSHRCASP1HRH4SMN1; SMN2 | |
| SCHEMBL28729581 | 0.79 | TSHR (0.48) | TSHRCASP1HRH4SMN1; SMN2 | |
| SCHEMBL12958450 | 0.76 | TSHR (0.46) | TSHRCASP1HRH4 | |
| SCHEMBL15867747 | 0.75 | TSHR (0.44) | TSHRCASP1HRH4 | |
| SCHEMBL1695647 | 0.75 | TSHR (1.00) | TSHRCASP1 | |
| SCHEMBL584717 | 0.74 | ALDH1A1 (0.33) | TSHRHRH4RPS6KB1GSK3B | |
| SCHEMBL4338963 | 0.71 | GRM5 (0.37) | TSHRRPS6KB1GSK3BSMN1; SMN2 | |
| SCHEMBL2157361 | 0.71 | TSHR (0.50) | TSHRCASP1HRH4 | |
| SCHEMBL3877612 | 0.71 | CYP1A2 (0.40) | TSHRRPS6KB1GSK3B | |
| Iodide SCHEMBL669031 | 0.70 | GRM5 (0.36) | TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1111972-B1 | Flexible printed substrate | SONY CHEM & INF DEVICE CORP (JP) | 2007-05-23 | — | — | EP | claimed |
| US-7098267-B2 | Polyamic acid varnish composition and a flexible printed board | SONY CHEMICALS CORP. (JP) | 2006-08-29 | — | — | US | claimed |
| CN-1213117-C | Polyamide acid varnish compsns. and flexible printing base plate | SONY CHEMICALS CO LTD (JP) | 2005-08-03 | — | — | CN | claimed |
| US-20050027099-A1 | Polyamic acid varnish composition and a flexible printed board | SONY CHEMICALS CORP (JP) | 2005-02-03 | — | — | US | claimed |
| US-6805967-B2 | Polyamic acid varnish composition and a flexible printed board | SONY CHEMICALS CORP. (JP) | 2004-10-19 | — | — | US | claimed |
| EP-1108762-B1 | Polyamic acid varnish composition and a flexible printed board | SONY CHEMICALS CORP (JP) | 2004-09-15 | — | — | EP | claimed |
| EP-1014765-B1 | Flexible printed board, polyamic acid and polyamic acid varnish containing same | SONY CHEMICALS CORP (JP) | 2003-03-12 | — | — | EP | claimed |
| US-6395399-B2 | METALLIC FOIL, E.G. COPPER, HAVING A POLYIMIDE LAYER PRODUCED BY FORMING A FILM OF A POLYAMIC ACID VARNISH FOLLOWED BY IMIDATING AND HAVING A SPECIFIC EXPANSION COEFFICIENT AND SOFTENING POINT; PRINTED CIRCUITS; NONCURLING | SONY CHEMICALS CORP. (JP) | 2002-05-28 | — | — | US | claimed |
| US-20010005730-A1 | Polyamic acid varnish composition and a flexible printed board | SONY CHEMICALS CORP. | 2001-06-28 | — | — | US | claimed |
| EP-1111972-A2 | Flexible printed substrate | Sony Chemicals Corporation (JP) | 2001-06-27 | — | — | EP | claimed |
| US-20010004496-A1 | Flexible printed substrate | SONY CHEMICALS CORP. | 2001-06-21 | — | — | US | claimed |
| EP-1108762-A2 | Polyamic acid varnish composition and a flexible printed board | Sony Chemicals Corporation (JP) | 2001-06-20 | — | — | EP | claimed |
| EP-1014765-A2 | Flexible printed board, polyamic acid and polyamic acid varnish containing same | Sony Chemicals Corporation (JP) | 2000-06-28 | — | — | EP | claimed |
| US-4501689-A | CONTAINING PYRIDINE OR IMIDAZOLE MODIFIED 5-TRIAZINE | TAMURA KAKEN CO., LTD. (JP) | 1985-02-26 | — | — | US | claimed |
| US-8986833-B2 | Enamel varnish composition for enamel wire and enamel wire using same | LS CABLE LTD. (KR) | 2015-03-24 | — | — | US | disclosed |
| EP-1355518-B1 | FLEXIBLE PRINTED WIRING BOARD | SONY CHEM & INF DEVICE CORP (JP) | 2013-09-25 | — | — | EP | disclosed |
| US-7972693-B2 | Enamel varnish composition for enamel wire and enamel wire using the same | LS CABLE LTD. (KR) | 2011-07-05 | — | — | US | disclosed |
| EP-1108762-A2 | Polyamic acid varnish composition and a flexible printed board | Sony Chemicals Corporation (JP) | 2001-06-20 | — | — | EP | disclosed |
| EP-1014765-A2 | Flexible printed board, polyamic acid and polyamic acid varnish containing same | Sony Chemicals Corporation (JP) | 2000-06-28 | — | — | EP | disclosed |
| US-4501689-A | CONTAINING PYRIDINE OR IMIDAZOLE MODIFIED 5-TRIAZINE | TAMURA KAKEN CO., LTD. (JP) | 1985-02-26 | — | — | US | disclosed |