Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.50 |
| ▸ | CASP1 | P29466 | 1/20 | 0.39 |
| ▸ | HRH4 | Q9H3N8 | 1/20 | 0.36 |
| ▸ | ALPL | P05186 | 2/20 | 0.35 |
| ▸ | PLAA | Q9Y263 | 1/20 | 0.35 |
| ▸ | ALPG | P10696 | 1/20 | 0.35 |
| ▸ | QPCT | Q16769 | 13/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22180834 | 0.77 | QPCT (0.38) | ALPLPLAAALPGQPCT | |
| SCHEMBL31490393 | 0.76 | ALPL (0.37) | ALPLPLAAALPGQPCT | |
| SCHEMBL1178918 | 0.72 | — | — | |
| SCHEMBL31251980 | 0.72 | QPCT (0.48) | ALPLPLAAALPGQPCT | |
| SCHEMBL2156190 | 0.71 | TSHR (0.59) | TSHRCASP1HRH4 | |
| SCHEMBL4468564 | 0.71 | KDM4C (0.41) | ALPLPLAAALPGQPCT | |
| Bromide SCHEMBL6375209 | 0.71 | ALPL (0.41) | TSHRHRH4ALPLPLAAALPG | |
| SCHEMBL466537 | 0.69 | QPCT (0.43) | ALPLPLAAALPGQPCT | |
| SCHEMBL2156851 | 0.69 | TSHR (0.51) | TSHRCASP1 | |
| SCHEMBL28800303 | 0.69 | QPCT (0.44) | ALPLPLAAALPGQPCT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1111972-B1 | Flexible printed substrate | SONY CHEM & INF DEVICE CORP (JP) | 2007-05-23 | — | — | EP | claimed |
| US-7098267-B2 | Polyamic acid varnish composition and a flexible printed board | SONY CHEMICALS CORP. (JP) | 2006-08-29 | — | — | US | claimed |
| US-20050027099-A1 | Polyamic acid varnish composition and a flexible printed board | SONY CHEMICALS CORP (JP) | 2005-02-03 | — | — | US | claimed |
| US-6805967-B2 | Polyamic acid varnish composition and a flexible printed board | SONY CHEMICALS CORP. (JP) | 2004-10-19 | — | — | US | claimed |
| EP-1108762-B1 | Polyamic acid varnish composition and a flexible printed board | SONY CHEMICALS CORP (JP) | 2004-09-15 | — | — | EP | claimed |
| EP-1014765-B1 | Flexible printed board, polyamic acid and polyamic acid varnish containing same | SONY CHEMICALS CORP (JP) | 2003-03-12 | — | — | EP | claimed |
| US-6395399-B2 | METALLIC FOIL, E.G. COPPER, HAVING A POLYIMIDE LAYER PRODUCED BY FORMING A FILM OF A POLYAMIC ACID VARNISH FOLLOWED BY IMIDATING AND HAVING A SPECIFIC EXPANSION COEFFICIENT AND SOFTENING POINT; PRINTED CIRCUITS; NONCURLING | SONY CHEMICALS CORP. (JP) | 2002-05-28 | — | — | US | claimed |
| US-20010005730-A1 | Polyamic acid varnish composition and a flexible printed board | SONY CHEMICALS CORP. | 2001-06-28 | — | — | US | claimed |
| EP-1111972-A2 | Flexible printed substrate | Sony Chemicals Corporation (JP) | 2001-06-27 | — | — | EP | claimed |
| US-20010004496-A1 | Flexible printed substrate | SONY CHEMICALS CORP. | 2001-06-21 | — | — | US | claimed |
| EP-1108762-A2 | Polyamic acid varnish composition and a flexible printed board | Sony Chemicals Corporation (JP) | 2001-06-20 | — | — | EP | claimed |
| EP-1014765-A2 | Flexible printed board, polyamic acid and polyamic acid varnish containing same | Sony Chemicals Corporation (JP) | 2000-06-28 | — | — | EP | claimed |
| CN-119613956-A | Curable maleimide resin composition, adhesive, primer, die coating agent, and semiconductor device | 信越化学工业株式会社 | 2025-03-14 | — | — | CN | disclosed |
| US-8986833-B2 | Enamel varnish composition for enamel wire and enamel wire using same | LS CABLE LTD. (KR) | 2015-03-24 | — | — | US | disclosed |
| EP-1355518-B1 | FLEXIBLE PRINTED WIRING BOARD | SONY CHEM & INF DEVICE CORP (JP) | 2013-09-25 | — | — | EP | disclosed |
| US-7972693-B2 | Enamel varnish composition for enamel wire and enamel wire using the same | LS CABLE LTD. (KR) | 2011-07-05 | — | — | US | disclosed |
| EP-1111972-A2 | Flexible printed substrate | Sony Chemicals Corporation (JP) | 2001-06-27 | — | — | EP | disclosed |
| US-20010004496-A1 | Flexible printed substrate | SONY CHEMICALS CORP. | 2001-06-21 | — | — | US | disclosed |
| EP-1108762-A2 | Polyamic acid varnish composition and a flexible printed board | Sony Chemicals Corporation (JP) | 2001-06-20 | — | — | EP | disclosed |
| EP-1014765-A2 | Flexible printed board, polyamic acid and polyamic acid varnish containing same | Sony Chemicals Corporation (JP) | 2000-06-28 | — | — | EP | disclosed |