SCHEMBL21572932

SCHEMBL21572932

CCC(COCC1CO1)(COCC1CO1)COC(=O)C(CCC(C)CC(C)(C)C)C(C)CC(C)(C)C

nearest known ligand 0.36

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.36
MAPK1 P28482 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23203780 0.84 ALDH1A1 (0.38) TSHRMAPK1
SCHEMBL28552540 0.83 TSHR (0.34) TSHRMAPK1
SCHEMBL12697180 0.76 TSHR (0.41) TSHRMAPK1
SCHEMBL28540564 0.75
SCHEMBL28538448 0.73 ALDH1A1 (0.32)
SCHEMBL26135818 0.73 TSHR (0.35) TSHRMAPK1
SCHEMBL23306979 0.72 TSHR (0.40) TSHRMAPK1
SCHEMBL23306977 0.72 TSHR (0.41) TSHRMAPK1
SCHEMBL12872760 0.72 MMP8 (0.35)
Bicarbonate SCHEMBL17599133 0.72 TSHR (0.53) TSHRMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023074812-A1 EPOXY RESIN COMPOSITION 日産化学株式会社 2023-05-04 WO disclosed
US-20190352448-A1 EPOXY RESIN COMPOSITION SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) 2019-11-21 US disclosed
EP-3569627-A1 EPOXY RESIN COMPOSITION Sumitomo Seika Chemicals Co. Ltd. (JP) 2019-11-20 EP disclosed