SCHEMBL215947

SCHEMBL215947

O=C1CC2C3CC(C(=O)OC3=O)C2C(=O)O1

nearest known ligand 0.34

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.34
GMNN O75496 1/20 0.34
PPM1B O75688 1/20 0.34
LMNA P02545 1/20 0.34
PPP1CC P36873 1/20 0.34
TFPI2 P48307 1/20 0.34
RAB9A P51151 1/20 0.34
PPP5C P53041 1/20 0.34
PPP1CA P62136 1/20 0.34
PMP22 Q01453 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
TP53 P04637 1/20 0.34
CYP2D6 P10635 1/20 0.34
NFKB1 P19838 1/20 0.34
THPO P40225 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21241534 1.00 KDM4E (0.34) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL20968363 1.00 KDM4E (0.34) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL19241223 1.00 KDM4E (0.34) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL21609706 1.00 KDM4E (0.34) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL8841230 1.00 KDM4E (0.34) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL12197536 0.85
SCHEMBL21322463 0.82
SCHEMBL18179375 0.81 ALDH1A1 (0.30)
SCHEMBL10361730 0.81 KDM4E (0.32) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL21118044 0.79 KDM4E (0.31) KDM4EGMNNPPM1BLMNAPPP1CC

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 508 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117510847-A Polyimide film and electronic device 杜邦电子公司 2024-02-06 CN claimed
CN-111607225-B Polyimide film and electronic device 杜邦电子公司 2024-01-26 CN claimed
US-11561440-B2 Photoalignment composition for the stabilization of the pre-tilt angle in liquid crystal layers Rolic Technologies AG (CH) 2023-01-24 US claimed
WO-2022269335-A1 A PROCESS FOR PREPARATION OF ALICYCLIC ACID DIANHYDRIDE VIVAN LIFE SCIENCES PVT. LIMITED (IN) 2022-12-29 WO claimed
US-10844174-B2 Low dielectric polyimide composition, polyimide, polyimide film and copper clad laminate using the same Zhen Ding Technology Co., Ltd. (TW) 2020-11-24 US claimed
US-20190085131-A1 LOW DIELECTRIC POLYIMIDE COMPOSITION, POLYIMIDE, POLYIMIDE FILM AND COPPER CLAD LAMINATE USING THE SAME Zhen Ding Technology Co., Ltd. (TW) 2019-03-21 US claimed
CN-122095296-A Dimming sheet, dimming device and manufacturing method of dimming sheet 2026-05-26 CN disclosed
US-20250333579-A1 COMPOSITION AND PACKAGE STRUCTURE INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2025-10-30 US disclosed
EP-4634327-A1 COMPOSITION FOR FORMING A LIQUID CRYSTAL ALIGNMENT FILM Rolic Technologies AG (CH) 2025-10-22 EP disclosed
US-20250270695-A1 METHODS, STRUCTURES, AND SYSTEMS FOR LITHOGRAPHIC PATTERNING ASM IP HOLDING B.V. (NL) 2025-08-28 US disclosed
US-12384886-B2 Porous polyimide composition and polyamide acid composition ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-08-12 US disclosed
US-20250215292-A1 ADHESIVE AND MULTILAYER STRUCTURE INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2025-07-03 US disclosed
US-20250180952-A1 PHOTOALIGNING MATERIALS Rolic Technologies AG (CH) 2025-06-05 US disclosed
US-20070213502-A1 Composition for forming insulating layer and insulating film JNC CORPORATION (JP) 2007-09-13 US disclosed
US-20070092743-A1 Liquid crystal display SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-04-26 US disclosed
US-20070092743-A1 Liquid crystal display SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-04-26 US disclosed
US-20070082965-A1 Photocuring resin composition, medical device using same and method for manufacturing same JSR CORPORATION (JP) 2007-04-12 US disclosed
US-7005248-B2 Method of forming cavity between multilayered wirings JSR CORPORATION (JP) 2006-02-28 US disclosed
US-20040092127-A1 Method of forming cavity between multilayered wirings JSR CORPORATION (JP) 2004-05-13 US disclosed
EP-1418618-A2 Method of forming cavites between multilayered wirings JSR Corporation (JP) 2004-05-12 EP disclosed