SCHEMBL2163307

SCHEMBL2163307

C=CC(=O)OCCc1ccc(C(=O)O)c(C(=O)O)c1CC(C)O

nearest known ligand 0.39

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
THRB P10828 2/20 0.39
TSHR P16473 6/20 0.35
ALDH1A1 P00352 3/20 0.35
TP53 P04637 2/20 0.35
HIF1A Q16665 2/20 0.35
HSD17B10 Q99714 1/20 0.35
HPGD P15428 1/20 0.33
CYP3A4 P08684 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29488419 1.00 THRB (0.39) THRBTSHRALDH1A1TP53HIF1A
SCHEMBL27968291 0.91 THRB (0.36) THRBTSHRALDH1A1TP53HIF1A
SCHEMBL2163303 0.91 THRB (0.39) THRBTSHRALDH1A1TP53HIF1A
SCHEMBL27582626 0.87 HCAR2 (0.33) ALDH1A1
SCHEMBL8551749 0.86 THRB (0.46) THRBTSHRALDH1A1TP53HIF1A
SCHEMBL11001905 0.86 THRB (0.38) THRBTSHRALDH1A1TP53HIF1A
SCHEMBL23881987 0.85 THRB (0.43) THRBTSHRALDH1A1TP53HIF1A
SCHEMBL28390939 0.84 THRB (0.42) THRBTSHRALDH1A1TP53HIF1A
SCHEMBL815210 0.84 POLB (0.38) THRBTSHR
SCHEMBL57689 0.83 THRB (0.43) THRBTSHRALDH1A1TP53HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 68 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0663931-A1 POLYMERISABLE CURABLE MOULDING COMPOUNDS AND MOULDING OR COATING PROCESS USING THIS MOULDING COMPOUND Henkel Kommanditgesellschaft auf Aktien (DE) 1995-07-26 EP claimed
WO-1994009050-A1 POLYMERISABLE CURABLE MOULDING COMPOUNDS AND MOULDING OR COATING PROCESS USING THIS MOULDING COMPOUND HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 1994-04-28 WO claimed
US-20250361378-A1 CURABLE COMPOSITION FOR SEALING MATERIAL, AND PANEL STRUCTURE USING SAID CURABLE COMPOSITION SEKISUI FULLER COMPANY, LTD. (JP) 2025-11-27 US disclosed
EP-4541829-A1 CURABLE COMPOSITION FOR SEALING MATERIAL, AND PANEL STRUCTURE USING SAID CURABLE COMPOSITION Sekisui Fuller Company, Ltd. (JP) 2025-04-23 EP disclosed
US-12109783-B2 Intermediate film for laminated glass, and laminated glass SEKISUI CHEMICAL CO., LTD. (JP) 2024-10-08 US disclosed
US-12049561-B2 Resin composition, resin film comprising said resin composition, and glass laminate including said resin film SEKISUI CHEMICAL CO., LTD. (JP) 2024-07-30 US disclosed
US-11850827-B2 Interlayer film for laminated glass and laminated glass SEKISUI CHEMICAL CO., LTD. (JP) 2023-12-26 US disclosed
US-11731399-B2 Interlayer film for laminated glass, and laminated glass SEKISUI CHEMICAL CO. LTD. (JP) 2023-08-22 US disclosed
US-11724481-B2 Interlayer film for laminated glass, and laminated glass SEKISUI CHEMICAL CO., LTD. (JP) 2023-08-15 US disclosed
US-11648755-B2 Laminated glass intermediate film and laminated glass SEKISUI CHEMICAL CO., LTD. (JP) 2023-05-16 US disclosed
US-20230002612-A1 RESIN COMPOSITION, RESIN FILM COMPRISING SAID RESIN COMPOSITION, AND GLASS LAMINATE INCLUDING SAID RESIN FILM SEKISUI CHEMICAL CO., LTD. (JP) 2023-01-05 US disclosed
CN-100334506-C Photosensitive resin composition using photosensitive resin DONGJIN SEMIKAN CO LTD (KR) 2007-08-29 CN disclosed
WO-2004044019-A1 WATER- AND OIL-REPELLENT COATING FILMS KANTO DENKA KOGYO CO., LTD. (JP) 2004-05-27 WO disclosed
CN-1497343-A Photoresist compound using photoresist 东进瑟弥侃株式会社 2004-05-19 CN disclosed
US-20030045757-A1 Modified polyphenylene ether ASAHI KASEI KABUSHIKI KAISHA (JP) 2003-03-06 US disclosed
US-5840465-A LOW MELTING GLASS WITH POLYMER LAYER FOR DISPLAY PANELS TAIYO INK MANUFACTURING CO., LTD. (JP) 1998-11-24 US disclosed
EP-0663931-A1 POLYMERISABLE CURABLE MOULDING COMPOUNDS AND MOULDING OR COATING PROCESS USING THIS MOULDING COMPOUND Henkel Kommanditgesellschaft auf Aktien (DE) 1995-07-26 EP disclosed
EP-0663931-A1 POLYMERISABLE CURABLE MOULDING COMPOUNDS AND MOULDING OR COATING PROCESS USING THIS MOULDING COMPOUND Henkel Kommanditgesellschaft auf Aktien (DE) 1995-07-26 EP disclosed
WO-1994009050-A1 POLYMERISABLE CURABLE MOULDING COMPOUNDS AND MOULDING OR COATING PROCESS USING THIS MOULDING COMPOUND HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 1994-04-28 WO disclosed
WO-1994009050-A1 POLYMERISABLE CURABLE MOULDING COMPOUNDS AND MOULDING OR COATING PROCESS USING THIS MOULDING COMPOUND HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 1994-04-28 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20030045757-A1 Modified polyphenylene ether COMT, PAH, CYP2C8 THRB 4254/4885TSHR 3802/4885ALDH1A1 1410/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.