SCHEMBL2166989

SCHEMBL2166989

CC(=O)CC(=O)C(C(C)=O)(C(C)=O)C(=O)O.[AlH3]

nearest known ligand 0.34

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.34
KDM6B O15054 1/20 0.34
KDM5C P41229 1/20 0.34
EGLN1 Q9GZT9 1/20 0.34
PHF8 Q9UPP1 1/20 0.34
KDM2A Q9Y2K7 1/20 0.34
MGAM O43451 1/20 0.33
GAA P10253 1/20 0.33
SI P14410 1/20 0.33
MGAM2 Q2M2H8 1/20 0.33
HTT P42858 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28706968 0.98 KDM4E (0.36) KDM4EKDM6BKDM5CEGLN1PHF8
SCHEMBL27756979 0.87 MGAM (0.38) KDM4EKDM6BKDM5CEGLN1PHF8
SCHEMBL970937 0.85 MGAM (0.39) KDM4EKDM6BKDM5CEGLN1PHF8
SCHEMBL23581431 0.82 MGAM (0.38) KDM4EKDM6BKDM5CEGLN1PHF8
SCHEMBL10824229 0.82 MGAM (0.38) KDM4EKDM6BKDM5CEGLN1PHF8
SCHEMBL6232159 0.82 MGAM (0.38) KDM4EKDM6BKDM5CEGLN1PHF8
Acetoacetic Acid SCHEMBL9250095 0.78 KDM4E (0.41) KDM4EKDM6BKDM5CEGLN1PHF8
SCHEMBL194307 0.76 FFAR3 (0.40)
SCHEMBL2166976 0.74 MGAM (0.32) MGAMGAASIMGAM2HTT
SCHEMBL1478378 0.73 FFAR3 (0.43)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12107198-B2 Barrier film and method for manufacturing the same, wavelength conversion sheet and method for manufacturing the same, and optical laminate and method for manufacturing the same TOPPAN PRINTING CO., LTD. (JP) 2024-10-01 US disclosed
WO-2024101192-A1 COMPOSITE RESIN COMPOSITION, METHOD FOR PRODUCING SAME, INSULATING RESIN COMPLEX AND POWER APPARATUS USING SAME 株式会社日立製作所 2024-05-16 WO disclosed
US-20190030859-A1 BARRIER FILM AND METHOD FOR MANUFACTURING THE SAME, WAVELENGTH CONVERSION SHEET AND METHOD FOR MANUFACTURING THE SAME, AND OPTICAL LAMINATE AND METHOD MANUFACTURING THE SAME TOPPAN PRINTING CO., LTD. (JP) 2019-01-31 US disclosed
EP-2460765-B1 INSULATED ULTRAFINE POWDER, METHOD FOR PRODUCING SAME, AND HIGH DIELECTRIC CONSTANT RESIN COMPOSITE MATERIAL MITSUBISHI GAS CHEMICAL CO (JP) 2018-06-06 EP disclosed
US-9493605-B2 Epoxy-vinyl copolymerization type liquid resin composition, cured product of the same, electronic/electric apparatus using the cured product, and method of producing the cured product HITACHI INDUSTRIAL EQUIPMENT SYSTEMS CO., LTD. (JP) 2016-11-15 US disclosed
US-9394447-B2 Insulated ultrafine powder, method for producing same, and high dielectric constant resin composite material MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2016-07-19 US disclosed
US-9315673-B2 Insulated ultrafine powder, method for producing same, and high dielectric constant resin composite material MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2016-04-19 US disclosed
EP-2851382-A1 EPOXY/VINYL COPOLYMER-TYPE LIQUID RESIN COMPOSITION, CURED ARTICLE THEREOF, ELECTRICAL/ELECTRONIC DEVICE USING SAID CURED ARTICLE, AND METHOD FOR PRODUCING SAID CURED ARTICLE Hitachi Industrial Equipment Systems Co., Ltd. (JP) 2015-03-25 EP disclosed
US-20140378580-A1 Epoxy-Vinyl Copolymerization Type Liquid Resin Composition, Cured Product of the Same, Electronic/Electric Apparatus using the Cured Product, and Method of Producing the Cured Product HITACHI INDUSTRIAL EQUIPMENT SYSTEMS CO., LTD. (JP) 2014-12-25 US disclosed
US-20140170305-A1 INSULATED ULTRAFINE POWDER, METHOD FOR PRODUCING SAME, AND HIGH DIELECTRIC CONSTANT RESIN COMPOSITE MATERIAL MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2014-06-19 US disclosed
EP-0488275-B1 Resin-impregnated superconducting magnet coil and process for its production HITACHI LTD (JP) 1997-04-02 EP disclosed
US-5606300-A FIXING RESIN WHICH SUPPRESSES MICROCRACKING HITACHI, LTD. (JP) 1997-02-25 US disclosed
US-5538942-A EPOXY RESIN HITACHI, LTD. (JP) 1996-07-23 US disclosed
US-5393805-A Coil for use in concrete including electric conductor molded in cured resin derived from polyfunctional epoxy resin, latent curing catalyst, alkali resistant filler, surfactant HITACHI, LTD. (JP) 1995-02-28 US disclosed
US-5384197-A Impregnated polyepoxide resin HITACHI, LTD. (JP) 1995-01-24 US disclosed
US-5324767-A Thermosetting resin composition for casting high-voltage coil, and molded coil and panel formed by casting and curing the composition HITACHI, LTD. (JP) 1994-06-28 US disclosed
EP-0602647-A1 Superconducting magnet, superconducting magnet coil, and manufacturing method thereof HITACHI, LTD. (JP) 1994-06-22 EP disclosed
EP-0488275-A2 Resin-impregnated superconducting magnet coil and process for it production HITACHI, LTD. (JP) 1992-06-03 EP disclosed
US-5075159-A Binding polyfunctional epoxy resin, impregnation bifunctional epoxy resin KOYAMA TOHRU (JP) 1991-12-24 US disclosed
EP-0413179-A2 Electrically insulated coil, electric rotating machine, and method of manufacturing same HITACHI, LTD. (JP) 1991-02-20 EP disclosed