⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL876640 | 0.80 | ALDH1A1 (0.38) | — | |
| Methacrylic Acid SCHEMBL2065726 | 0.76 | ALDH1A1 (0.34) | — | |
| SCHEMBL6761588 | 0.75 | TSHR (0.49) | — | |
| SCHEMBL2293082 | 0.72 | — | — | |
| SCHEMBL4392898 | 0.71 | TSHR (0.31) | — | |
| SCHEMBL464844 | 0.68 | ALDH1A1 (0.37) | — | |
| SCHEMBL11565517 | 0.67 | — | — | |
| SCHEMBL20302072 | 0.66 | — | — | |
| SCHEMBL512421 | 0.66 | — | — | |
| SCHEMBL2490666 | 0.66 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4693396-A1 | THERMALLY CONDUCTIVE SHEET AND METHOD FOR MANUFACTURING SAME | Sekisui Chemical Co., Ltd. (JP) | 2026-02-11 | — | — | EP | disclosed |
| US-20250277112-A1 | THERMALLY CONDUCTIVE COMPOSITION AND THERMALLY CONDUCTIVE MEMBER | SEKISUI POLYMATECH CO., LTD. (JP) | 2025-09-04 | — | — | US | disclosed |
| US-20250203815-A1 | THERMALLY-CONDUCTIVE SHEET | SEKISUI POLYMATECH CO., LTD. (JP) | 2025-06-19 | — | — | US | disclosed |
| US-20250163299-A1 | THERMALLY-CONDUCTIVE SHEET, METHOD FOR INSTALLING SAME, AND METHOD FOR MANUFACTURING SAME | SEKISUI POLYMATECH CO., LTD. (JP) | 2025-05-22 | — | — | US | disclosed |
| EP-4502102-A1 | THERMALLY-CONDUCTIVE COMPOSITION, TWO-PART THERMALLY-CONDUCTIVE MATERIAL, DELIVERY FORM OF THERMALLY-CONDUCTIVE COMPOSITION, THERMALLY-CONDUCTIVE MEMBER, BATTERY MODULE, AND METHOD FOR MANUFACTURING DELIVERY FORM OF THERMALLY-CONDUCTIVE COMPOSITION | Sekisui Polymatech Co., Ltd. (JP) | 2025-02-05 | — | — | EP | disclosed |
| EP-4503120-A1 | THERMALLY-CONDUCTIVE SHEET | Sekisui Polymatech Co., Ltd. (JP) | 2025-02-05 | — | — | EP | disclosed |
| EP-4503119-A1 | THERMALLY-CONDUCTIVE SHEET, METHOD FOR INSTALLING SAME, AND METHOD FOR MANUFACTURING SAME | Sekisui Polymatech Co., Ltd. (JP) | 2025-02-05 | — | — | EP | disclosed |
| US-20240417615-A1 | THERMALLY CONDUCTIVE SHEET | SEKISUI POLYMATECH CO., LTD. (JP) | 2024-12-19 | — | — | US | disclosed |
| US-20240400878-A1 | THERMALLY CONDUCTIVE COMPOSITION AND THERMALLY CONDUCTIVE MEMBER | SEKISUI POLYMATECH CO., LTD. (JP) | 2024-12-05 | — | — | US | disclosed |
| EP-4428199-A1 | THERMALLY CONDUCTIVE COMPOSITION AND THERMALLY CONDUCTIVE MEMBER | Sekisui Polymatech Co., Ltd. (JP) | 2024-09-11 | — | — | EP | disclosed |
| WO-2023054538-A1 | THERMALLY CONDUCTIVE COMPOSITION AND THERMALLY CONDUCTIVE MEMBER | 積水ポリマテック株式会社 | 2023-04-06 | — | — | WO | disclosed |
| EP-4130132-A1 | SILICONE COMPOSITION AND METHOD FOR MANUFACTURING SILICONE COMPOSITION | Sekisui Polymatech Co., Ltd. (JP) | 2023-02-08 | — | — | EP | disclosed |
| WO-2022210419-A1 | METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE SHEET | 積水ポリマテック株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022163192-A1 | HEAT-CONDUCTIVE SHEET, METHOD FOR INSTALLING SAME, AND METHOD FOR MANUFACTURING SAME | 積水ポリマテック株式会社 | 2022-08-04 | — | — | WO | disclosed |
| WO-2022137762-A1 | HEAT-CONDUCTIVE SHEET, METHOD FOR INSTALLING SAME, AND METHOD FOR MANUFACTURING SAME | 積水ポリマテック株式会社 | 2022-06-30 | — | — | WO | disclosed |
| WO-2022070568-A1 | HEAT-CONDUCTIVE SHEET, METHOD FOR ATTACHING SAME AND METHOD FOR PRODUCING SAME | 積水ポリマテック株式会社 | 2022-04-07 | — | — | WO | disclosed |
| EP-3608384-B1 | HEAT-CONDUCTIVE SHEET | SEKISUI POLYMATECH CO LTD (JP) | 2022-02-09 | — | — | EP | disclosed |
| US-11008462-B2 | Heat-conductive sheet | SEKISUI POLYMATECH CO., LTD. (JP) | 2021-05-18 | — | — | US | disclosed |
| US-20200385577-A1 | HEAT-CONDUCTIVE SHEET | SEKISUI POLYMATECH CO., LTD. (JP) | 2020-12-10 | — | — | US | disclosed |
| EP-3608384-A1 | HEAT-CONDUCTIVE SHEET | Sekisui Polymatech Co., Ltd. (JP) | 2020-02-12 | — | — | EP | disclosed |