SCHEMBL21671033

SCHEMBL21671033

CCOC(=O)O/N=C(/C)C(=O)c1ccccc1

nearest known ligand 0.50

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.50
MAPT P10636 2/20 0.50
KMT2A Q03164 3/20 0.44
L3MBTL1 Q9Y468 2/20 0.44
MEN1 O00255 2/20 0.43
CES2 O00748 6/20 0.43
CES1 P23141 6/20 0.43
NPC1 O15118 2/20 0.43
SMN1; SMN2 Q16637 3/20 0.41
LMNA P02545 1/20 0.40
GAA P10253 2/20 0.40
KDM4E B2RXH2 1/20 0.40
TSHR P16473 1/20 0.40
RAB9A P51151 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL195608 1.00 ALDH1A1 (0.50) ALDH1A1MAPTKMT2AL3MBTL1MEN1
SCHEMBL195607 1.00 ALDH1A1 (0.50) ALDH1A1MAPTKMT2AL3MBTL1MEN1
Propionaldehyde SCHEMBL28834453 0.93 MAPT (0.44) ALDH1A1MAPTKMT2AL3MBTL1MEN1
SCHEMBL13538631 0.87 ALDH1A1 (0.53) ALDH1A1MAPTKMT2AL3MBTL1MEN1
SCHEMBL29217084 0.85 ALDH1A1 (0.44) ALDH1A1MAPTKMT2AL3MBTL1MEN1
SCHEMBL22611951 0.85 CES2 (0.41) ALDH1A1MAPTKMT2AL3MBTL1MEN1
SCHEMBL30231228 0.84 ALDH1A1 (0.47) ALDH1A1MAPTKMT2AL3MBTL1MEN1
SCHEMBL2374643 0.82 CES2 (0.47) ALDH1A1MAPTKMT2AL3MBTL1MEN1
SCHEMBL2374640 0.82 CES2 (0.47) ALDH1A1MAPTKMT2AL3MBTL1MEN1
SCHEMBL27836929 0.82 ALDH1A1 (0.49) ALDH1A1MAPTKMT2AMEN1NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230359122-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT HD MICROSYSTEMS, LTD. (JP) 2023-11-09 US disclosed
US-20230359122-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT HD MICROSYSTEMS, LTD. (JP) 2023-11-09 US disclosed
US-11226560-B2 Photosensitive resin composition, cured pattern production method, cured product, interlayer insulating film, cover coat layer, surface protective layer, and electronic component HD MICROSYSTEMS, LTD. (JP) 2022-01-18 US disclosed
US-20210382391-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT HD MICROSYSTEMS, LTD. (JP) 2021-12-09 US disclosed
WO-2021215374-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 (JP) 2021-10-28 WO disclosed
US-20210311390-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT HD MICROSYSTEMS, LTD. (JP) 2021-10-07 US disclosed
US-20200041900-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PATTERN PRODUCTION METHOD, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE LAYER, AND ELECTRONIC COMPONENT HD MICROSYSTEMS, LTD. (JP) 2020-02-06 US disclosed