SCHEMBL216847

SCHEMBL216847

C=CC(=O)OC1(CCCCOC)C2CC3CC(C2)CC1C3

nearest known ligand 0.35

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 3/20 0.35
TSHR P16473 3/20 0.33
ALDH1A1 P00352 2/20 0.33
CYP3A4 P08684 1/20 0.33
MAPK1 P28482 1/20 0.32
HPGD P15428 1/20 0.31
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14580044 0.96 EPHX2 (0.35) EPHX2TSHRALDH1A1CYP3A4MAPK1
SCHEMBL14580037 0.90 MAPK1 (0.36) EPHX2TSHRALDH1A1MAPK1HPGD
SCHEMBL14580042 0.87 EPHX2 (0.39) EPHX2TSHRALDH1A1CYP3A4HPGD
SCHEMBL4400897 0.86 THRB (0.40) EPHX2TSHRHPGD
SCHEMBL4401582 0.85 THRB (0.40) EPHX2TSHRHPGD
SCHEMBL4403711 0.85 THRB (0.40) EPHX2TSHRHPGD
SCHEMBL4401864 0.85 THRB (0.40) EPHX2TSHRHPGD
SCHEMBL711021 0.85 TSHR (0.40) EPHX2TSHRHPGD
SCHEMBL14580050 0.81 HSD11B1 (0.31)
SCHEMBL215042 0.81 THRB (0.36) TSHRALDH1A1HPGDMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250189896-A1 RESIST UNDERLAYER FILM FORMATION COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2025-06-12 US disclosed
US-20250136734-A1 PROTECTIVE-FILM FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2025-05-01 US disclosed
CN-118786391-A Composition for forming resist underlayer film 日产化学株式会社 2024-10-15 CN disclosed
CN-118742856-A Composition for forming protective film 日产化学株式会社 2024-10-01 CN disclosed
WO-2023162653-A1 RESIST UNDERLAYER FILM FORMATION COMPOSITION 日産化学株式会社 2023-08-31 WO disclosed
WO-2023157772-A1 PROTECTIVE FILM FORMING COMPOSITION 日産化学株式会社 2023-08-24 WO disclosed
US-11592747-B2 Resist underlayer film-forming composition comprising carbonyl-containing polyhydroxy aromatic ring novolac resin NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2023-02-28 US disclosed
US-11199777-B2 Resist underlayer film-forming composition containing novolac polymer having secondary amino group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2021-12-14 US disclosed
CN-104412163-B Method for manufacturing semiconductor device using composition for forming organic underlayer film for solvent development lithography process 日产化学工业株式会社 2020-05-22 CN disclosed
CN-105874386-B Resist underlayer film-forming composition containing novolac polymer having secondary amino group 日产化学工业株式会社 2019-12-06 CN disclosed
US-7175963-B2 Chemical amplification type positive resist composition and a resin therefor SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-02-13 US disclosed
US-7175963-B2 Chemical amplification type positive resist composition and a resin therefor SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-02-13 US disclosed
US-20060234156-A1 Composition for formation of underlayer film for lithography containing epoxy compound and carboxylic acid compound NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2006-10-19 US disclosed
US-20060210915-A1 Composition for forming lower layer film for lithography comprising compound having protected carboxyl group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2006-09-21 US disclosed
EP-1662769-A1 COMPOSITION FOR FORMING LOWER LAYER FILM FOR LITHOGRAPHY COMPRISING COMPOUND HAVING PROTECTED CARBOXYL GROUP Nissan Chemical Industries, Ltd. (JP) 2006-05-31 EP disclosed
EP-1617289-A1 COMPOSITION FOR FORMATION OF UNDERLAYER FILM FOR LITHOGRAPHY CONTAINING EPOXY COMPOUND AND CARBOXYLIC ACID COMPOUND Nissan Chemical Industries, Ltd. (JP) 2006-01-18 EP disclosed
US-6824956-B2 ADDITION POLYMER CONTAINING UNITS OF AN ADAMANTYL ESTER HAVING HYDROXY GROUPS FUJI PHOTO FILM CO., LTD. (JP) 2004-11-30 US disclosed
WO-2003104182-A1 2-ALKOXYALKYL-2-ADAMANTYL (METH)ACRYLATE AND METHOD FOR PREPARING SAME ENF TECHNOLOGY CO., LTD. (KR) 2003-12-18 WO disclosed
US-20030194640-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2003-10-16 US disclosed
EP-1338922-A2 Positive resist composition FUJI PHOTO FILM CO., LTD. (JP) 2003-08-27 EP disclosed