Methacrylic Acid

Methacrylic Acid

SCHEMBL2169271

C=C(C)C(=O)O.C=C(C)C(=O)O.Oc1ccc(-c2ccc(O)cc2)cc1

nearest known ligand 0.58

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSD17B1 P14061 2/20 0.58
ESR1 P03372 2/20 0.52
ESR2 Q92731 2/20 0.52
MMP3 P08254 1/20 0.50
BCL2L1 Q07817 1/20 0.50
MAPT P10636 3/20 0.48
MEN1 O00255 2/20 0.48
KMT2A Q03164 2/20 0.48
LMNA P02545 1/20 0.48
RAB9A P51151 1/20 0.48
CPT1B Q92523 1/20 0.44
PREP P48147 3/20 0.42
CELA1 Q9UNI1 1/20 0.42
CA12 O43570 2/20 0.42
CA1 P00915 2/20 0.42
CA2 P00918 2/20 0.42
CA3 P07451 2/20 0.42
CA4 P22748 2/20 0.42
CA7 P43166 2/20 0.42
CA9 Q16790 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methacrylic Acid SCHEMBL9539106 0.94 MMP3 (0.62) HSD17B1ESR1ESR2MMP3BCL2L1
Hydroquinone SCHEMBL4836285 0.93 CPT1B (0.50) HSD17B1ESR1ESR2MAPTMEN1
Hydroquinone SCHEMBL215943 0.93 CPT1B (0.50) HSD17B1ESR1ESR2MAPTMEN1
Acetic Acid SCHEMBL9809831 0.85 HSD17B1 (0.68) HSD17B1ESR1ESR2MMP3BCL2L1
Phenol SCHEMBL9052733 0.83 CA12 (0.55) ESR1MMP3BCL2L1MAPTMEN1
Phenol SCHEMBL184346 0.83 CA12 (0.55) ESR1MMP3BCL2L1MAPTMEN1
Tannin Pyrogallol SCHEMBL16192271 0.83 SMN1; SMN2 (0.60) MMP3BCL2L1MAPTLMNARAB9A
Phenol SCHEMBL1199743 0.83 CA12 (0.55) ESR1MMP3BCL2L1MAPTMEN1
Phenol SCHEMBL174433 0.83 CA12 (0.55) ESR1MMP3BCL2L1MAPTMEN1
Phenol SCHEMBL165006 0.83 CA12 (0.55) ESR1MMP3BCL2L1MAPTMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12325806-B2 Photocurable composition for use in 3D printing BASF SE (DE) 2025-06-10 US disclosed
EP-3681961-B1 APPLICATION OF POLYFUNCTIONAL LIGANDS FOR IMPROVING PERFORMANCE AND STABILITY OF QUANTUM DOT INKS SHOEI CHEMICAL IND CO (JP) 2023-12-27 EP disclosed
US-11584646-B2 Homogeneous anaerobically stable quantum dot concentrates NANOSYS, INC. (US) 2023-02-21 US disclosed
US-11267980-B2 Application of polyfunctional ligands for improving performance and stability of quantum dot inks NANOSYS, INC. (US) 2022-03-08 US disclosed
US-20220033678-A1 PHOTOCURABLE COMPOSITION FOR USE IN 3D PRINTING BASF SE (DE) 2022-02-03 US disclosed
EP-3856807-A1 PHOTOCURABLE COMPOSITION FOR USE IN 3D PRINTING BASF SE (DE) 2021-08-04 EP disclosed
US-11041071-B2 Peg-based ligands with enhanced dispersibility and improved performance NANOSYS, INC. (US) 2021-06-22 US disclosed
US-20210130170-A1 HOMOGENEOUS ANAEROBICALLY STABLE QUANTUM DOT CONCENTRATES NANOSYS, INC. (US) 2021-05-06 US disclosed
US-10961448-B2 Acid stabilization of quantum dot-resin concentrates and premixes NANOSYS, INC. (US) 2021-03-30 US disclosed
US-10919770-B2 Homogeneous anaerobically stable quantum dot concentrates NANOSYS, INC. (US) 2021-02-16 US disclosed
WO-2012126695-A1 STABLE CURABLE THIOL-ENE COMPOSITION HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) 2012-09-27 WO disclosed
US-20110195237-A1 SYSTEM AND RESIN FOR RAPID PROTOTYPING HUNTSMAN INTERNATIONAL LLC (US) 2011-08-11 US disclosed
EP-2346672-A1 SYSTEM AND RESIN FOR RAPID PROTOTYPING Huntsman Advanced Materials (Switzerland) GmbH (CH) 2011-07-27 EP disclosed
WO-2010043463-A1 SYSTEM AND RESIN FOR RAPID PROTOTYPING HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) 2010-04-22 WO disclosed
US-7119136-B2 Flame-retardant thermoset composition, method, and article GENERAL ELECTRIC COMPANY (US) 2006-10-10 US disclosed
US-20060167142-A9 FLAME-RETARDANT THERMOSET COMPOSITION, METHOD, AND ARTICLE GENERAL ELECTRIC COMPANY 2006-07-27 US disclosed
WO-2005033179-A1 FLAME-RETARDANT THERMOSET COMPOSITION, METHOD, AND ARTICLE GENERAL ELECTRIC COMPANY (US) 2005-04-14 WO disclosed
US-20050075427-A1 Flame-retardant thermoset composition, method, and article GENERAL ELECTRIC COMPANY 2005-04-07 US disclosed
US-6143804-A PYROLYZABLE CHEMICAL FOAMING AGENT TORAY INDUSTRIES, INC. (JP) 2000-11-07 US disclosed
EP-0972795-A1 Curable and foamable polyolefinic resin composition, cured foam of polyolefinic resin and method for producing it TORAY INDUSTRIES, INC. (JP) 2000-01-19 EP disclosed