SCHEMBL21747532

SCHEMBL21747532

Cc1ccc(C[N+](C)(C)c2ccccc2)cc1.F[Sb-](F)(F)(F)(F)F

nearest known ligand 0.39

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.39
TDP1 Q9NUW8 2/20 0.39
KDM4E B2RXH2 1/20 0.39
LMNA P02545 3/20 0.37
POLB P06746 3/20 0.37
ACHE P22303 2/20 0.35
SMN1; SMN2 Q16637 2/20 0.35
MEN1 O00255 3/20 0.35
KMT2A Q03164 3/20 0.35
TSHR P16473 1/20 0.34
ALOX12 P18054 1/20 0.34
APOBEC3A P31941 1/20 0.34
APOBEC3G Q9HC16 1/20 0.34
HTT P42858 1/20 0.34
CYP2C19 P33261 1/20 0.34
IDO1 P14902 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
MAPT P10636 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL565173 0.93 ALDH1A1 (0.45) ALDH1A1TDP1KDM4ELMNAPOLB
Hydrochloric Acid SCHEMBL8768477 0.91 ALDH1A1 (0.48) ALDH1A1TDP1KDM4ELMNAPOLB
SCHEMBL22129821 0.89 ALDH1A1 (0.39) ALDH1A1TDP1KDM4ELMNAPOLB
SCHEMBL29363761 0.89 KDM4E (0.50) ALDH1A1TDP1KDM4EACHESMN1; SMN2
SCHEMBL564455 0.85 ALDH1A1 (0.50) ALDH1A1TDP1KDM4ELMNAPOLB
SCHEMBL14948335 0.83 CYP2C19 (0.43) ALDH1A1TDP1KDM4ELMNAPOLB
SCHEMBL26948991 0.82 IDO1 (0.42) ALDH1A1TDP1KDM4EACHESMN1; SMN2
Fluoride Ion SCHEMBL4072236 0.81 ALDH1A1 (0.47) ALDH1A1TDP1KDM4ELMNAPOLB
SCHEMBL23069371 0.81 LTA4H (0.49) ALDH1A1KDM4EACHESMN1; SMN2MEN1
SCHEMBL565108 0.80 KDM4E (0.58) ALDH1A1TDP1KDM4EACHESMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12516211-B2 Ink composition and electronic device including film formed using the ink composition SAMSUNG DISPLAY CO., LTD. (KR) 2026-01-06 US disclosed
CN-115943732-B Sealing agent for organic EL display element 积水化学工业株式会社 2025-05-02 CN disclosed
CN-114286832-B Photocurable resin composition for electronic device 积水化学工业株式会社 2025-03-04 CN disclosed
CN-113811558-B Photocurable resin composition for electronic device 积水化学工业株式会社 2025-01-28 CN disclosed
CN-113454182-B Sealing agent for organic EL display element 积水化学工业株式会社 2025-01-17 CN disclosed
CN-114716648-B Sealing agent for organic electroluminescent display element 积水化学工业株式会社 2025-01-07 CN disclosed
CN-113330046-B Resin composition and peripheral sealing agent for organic EL display element 积水化学工业株式会社 2024-12-20 CN disclosed
CN-111937493-B Sealing agent for organic EL display element and top emission type organic EL display element 积水化学工业株式会社 2024-09-06 CN disclosed
CN-111837456-B Sealing agent for organic EL display element 积水化学工业株式会社 2024-08-20 CN disclosed
CN-111837457-B Sealing agent for organic EL display element 积水化学工业株式会社 2024-08-13 CN disclosed
WO-2020158776-A1 SEALANT FOR ORGANIC EL DISPLAY ELEMENT 積水化学工業株式会社 2020-08-06 WO disclosed
WO-2020149359-A1 SEALING AGENT SET FOR ORGANIC EL DISPLAY ELEMENT, AND ORGANIC EL DISPLAY ELEMENT 積水化学工業株式会社 2020-07-23 WO disclosed
WO-2020149362-A1 CURED PRODUCT AND ORGANIC EL DISPLAY ELEMENT 積水化学工業株式会社 2020-07-23 WO disclosed
WO-2020149358-A1 RESIN COMPOSITION FOR SEALING ORGANIC EL DISPLAY ELEMENT, CURED PRODUCT, AND ORGANIC EL DISPLAY ELEMENT 積水化学工業株式会社 2020-07-23 WO disclosed
WO-2020149363-A1 RESIN COMPOSITION FOR SEALING ORGANIC EL DISPLAY ELEMENT, CURED PRODUCT, AND ORGANIC EL DISPLAY ELEMENT 積水化学工業株式会社 2020-07-23 WO disclosed
WO-2020149360-A1 CURED PRODUCT AND ORGANIC EL DISPLAY ELEMENT 積水化学工業株式会社 2020-07-23 WO disclosed
WO-2020129794-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT AND ORGANIC EL DISPLAY ELEMENT 積水化学工業株式会社 2020-06-25 WO disclosed
WO-2020129792-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT AND ORGANIC EL DISPLAY ELEMENT 積水化学工業株式会社 2020-06-25 WO disclosed
US-20200127206-A1 COMPOSITION FOR ENCAPSULATING ORGANIC ELECTRONIC ELEMENT LG CHEM, LTD. (KR) 2020-04-23 US disclosed
EP-3613789-A1 COMPOSITION FOR SEALING ORGANIC ELECTRONIC ELEMENT LG Chem, Ltd. (KR) 2020-02-26 EP disclosed