SCHEMBL21751183

SCHEMBL21751183

C#CC1(O)C=CC(c2ccccc2)=CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1532972 0.83
SCHEMBL27564610 0.78
SCHEMBL27860669 0.77
SCHEMBL222999 0.77 ALDH1A1 (0.31)
SCHEMBL28115481 0.77
Biphenyl SCHEMBL27559195 0.75 ALDH1A1 (0.35)
SCHEMBL4794114 0.75
SCHEMBL30697824 0.75
SCHEMBL29192378 0.74 CACNA2D1 (0.34)
SCHEMBL23581152 0.74 MMP3 (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250115691-A1 METHOD OF FORMING PATTERNS SAMSUNG SDI CO LTD (KR) 2025-04-10 US disclosed
CN-117881432-A Porphyrin-hydrogen porphyrin compounds, compositions comprising the same, and methods of use thereof 北卡罗莱纳州立大学 2024-04-12 CN disclosed
US-20230406970-A1 METHOD OF FORMING PATTERNS SAMSUNG SDI CO LTD (KR) 2023-12-21 US disclosed
CN-110845649-B Polymer, organic layer composition, and method of forming pattern 三星SDI株式会社 2023-06-06 CN disclosed
CN-110845649-A Polymer, organic layer composition and method of forming pattern 三星SDI株式会社 2020-02-28 CN disclosed
US-20200062875-A1 POLYMER, ORGANIC LAYER COMPOSITION AND METHOD OF FORMING PATTERNS SAMSUNG SDI CO., LTD. (KR) 2020-02-27 US disclosed