Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 2/20 | 0.53 |
| ▸ | TYR | P14679 | 1/20 | 0.53 |
| ▸ | TSHR | P16473 | 5/20 | 0.49 |
| ▸ | HPGD | P15428 | 3/20 | 0.49 |
| ▸ | TP53 | P04637 | 2/20 | 0.49 |
| ▸ | MAPT | P10636 | 2/20 | 0.49 |
| ▸ | MEN1 | O00255 | 2/20 | 0.49 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.49 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.49 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.49 |
| ▸ | PPARG | P37231 | 1/20 | 0.49 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.49 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.46 |
| ▸ | ESRRG | P62508 | 6/20 | 0.41 |
| ▸ | MIF | P14174 | 1/20 | 0.41 |
| ▸ | ESRRB | O95718 | 1/20 | 0.40 |
| ▸ | ESR1 | P03372 | 2/20 | 0.39 |
| ▸ | ESR2 | Q92731 | 2/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.39 |
| ▸ | AR | P10275 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Bisphenol A SCHEMBL50024 | 0.90 | TSHR (0.61) | LMNATYRTSHRHPGDTP53 | |
| SCHEMBL791565 | 0.90 | TSHR (0.49) | LMNATYRTSHRHPGDTP53 | |
| SCHEMBL16655607 | 0.90 | TSHR (0.61) | LMNATYRTSHRHPGDTP53 | |
| SCHEMBL10436691 | 0.89 | SMN1; SMN2 (0.58) | LMNATYRTSHRHPGDTP53 | |
| Acrylic Acid SCHEMBL27899424 | 0.88 | LMNA (0.41) | LMNATYRTSHRHPGDTP53 | |
| Hydroquinone SCHEMBL50263 | 0.86 | TSHR (0.48) | LMNATSHRHPGDTP53MAPT | |
| Bisphenol A SCHEMBL1036139 | 0.84 | MEN1 (0.61) | TSHRHPGDTP53MAPTMEN1 | |
| SCHEMBL8969745 | 0.84 | TSHR (0.51) | LMNATYRTSHRHPGDTP53 | |
| SCHEMBL28331948 | 0.84 | MEN1 (0.49) | TSHRHPGDTP53MAPTMEN1 | |
| SCHEMBL27028823 | 0.84 | ESR1 (0.59) | TSHRHPGDTP53MAPTMEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 187 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117683388-A | ABS plastic paint diluent and application thereof | 索菲立(福建)新材料科技有限公司 | 2024-03-12 | — | — | CN | claimed |
| CN-116987233-A | Cationic UV (ultraviolet) heat curing composition and preparation method thereof | 上海汉司实业有限公司 | 2023-11-03 | — | — | CN | claimed |
| WO-2023142101-A1 | THREE COMPONENT COMPOSITION FOR THE MANUFACTURE OF POLYURETHANE CEMENTITIOUS HYBRID FLOORING OR COATING WITH IMPROVED WORKABILITY | SIKA TECHNOLOGY AG (CH) | 2023-08-03 | — | — | WO | claimed |
| CN-114214017-B | Bio-based epoxy underfill with high Tg and excellent thermal stability and preparation method thereof | 烟台德邦科技股份有限公司 | 2023-05-23 | — | — | CN | claimed |
| CN-115678473-A | Single-component silver conductive adhesive suitable for normal-temperature storage and preparation method thereof | 宁夏中色新材料有限公司 | 2023-02-03 | — | — | CN | claimed |
| CN-110582540-B | Photocurable epoxy composition | 汉高股份有限及两合公司 | 2022-11-22 | — | — | CN | claimed |
| CN-112778948-B | Conductive silver adhesive and preparation method and application thereof | 北京康美特科技股份有限公司 | 2022-06-24 | — | — | CN | claimed |
| CN-112080238-B | Heat-conducting filling adhesive and preparation method and application thereof | 江苏矽时代材料科技有限公司 | 2022-05-27 | — | — | CN | claimed |
| CN-114214017-A | Bio-based epoxy underfill with high Tg and excellent thermal stability and preparation method thereof | 烟台德邦科技股份有限公司 | 2022-03-22 | — | — | CN | claimed |
| CN-112778948-A | Conductive silver adhesive and preparation method and application thereof | 北京康美特科技股份有限公司 | 2021-05-11 | — | — | CN | claimed |
| CN-102774165-A | Printing form and process for preparing the printing form with curable composition having epoxy novolac resin | DU PONT | 2012-11-14 | — | — | CN | claimed |
| CN-102774166-A | Printing form and process for preparing the printing form with curable composition having bisphenol-based epoxy resin | DU PONT | 2012-11-14 | — | — | CN | claimed |
| CN-102675827-A | Epoxy resin-based carbon fibre compound material formed by using high polymer (HP)-resin transfer molding (RTM) process quickly | ZHENJIANG YUDA COMPOSITE MATERIALS CO LTD | 2012-09-19 | — | — | CN | claimed |
| CN-101585956-B | Epoxy resin system for casting process of wind electricity generation vanes | ZHUZHOU TIMES ENGINEERING PLASTIC PRODUCTS CO LTD | 2012-03-28 | — | — | CN | claimed |
| CN-102304217-A | Epoxy solvent-free impregnating resin with low viscosity and preparation method thereof | ZHUZHOU TIMES NEW MAT TECH CO | 2012-01-04 | — | — | CN | claimed |
| CN-102020831-A | Composite material for wind power generation blades | Shanghai kangda new energy material co ltd | 2011-04-20 | — | — | CN | claimed |
| CN-101880443-A | Low-viscosity epoxy resin system for resin transfer molding and preparation and using method thereof | ZHUZHOU TIMES NEW MAT TECH CO | 2010-11-10 | — | — | CN | claimed |
| CN-100569826-C | A kind of self-emulsifying type aqueous latex of epoxy hardener and preparation method thereof | XIUPA CHEMICAL CO LTD (CN) | 2009-12-16 | — | — | CN | claimed |
| CN-101585956-A | The epoxy-resin systems that is used for casting process of wind electricity generation vanes | ZHUZHOU TIMES ENGINEERING PLAS (CN) | 2009-11-25 | — | — | CN | claimed |
| CN-101050300-A | Self-emulsifying type aqueous latex of epoxy hardener, and preparation method | XIUPA CHEMICAL CO LTD GUANGZHO (CN) | 2007-10-10 | — | — | CN | claimed |