SCHEMBL791565

SCHEMBL791565

C(OCC1CO1)C1CO1.CC(c1ccc(O)cc1)(c1ccc(O)cc1)c1ccc(O)cc1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 5/20 0.49
ALDH1A1 P00352 5/20 0.49
HPGD P15428 3/20 0.49
MEN1 O00255 3/20 0.49
KMT2A Q03164 3/20 0.49
TP53 P04637 2/20 0.49
MAPT P10636 2/20 0.49
CYP1A2 P05177 1/20 0.49
PPARG P37231 1/20 0.49
HIF1A Q16665 1/20 0.49
ESR1 P03372 5/20 0.47
ESR2 Q92731 5/20 0.47
MAPK1 P28482 1/20 0.46
CYP3A4 P08684 2/20 0.39
LMNA P02545 1/20 0.39
TYR P14679 1/20 0.39
AR P10275 1/20 0.39
SLC6A2 P23975 1/20 0.39
SLC6A4 P31645 1/20 0.39
HTR6 P50406 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL217716 0.90 LMNA (0.53) TSHRALDH1A1HPGDMEN1KMT2A
SCHEMBL16655607 0.90 TSHR (0.61) TSHRALDH1A1HPGDMEN1KMT2A
Bisphenol A SCHEMBL50024 0.90 TSHR (0.61) TSHRALDH1A1HPGDMEN1KMT2A
SCHEMBL791566 0.86 ALDH1A1 (0.69) TSHRALDH1A1HPGDMEN1KMT2A
Hydroquinone SCHEMBL50263 0.86 TSHR (0.48) TSHRALDH1A1HPGDMEN1KMT2A
Bisphenol A SCHEMBL1036139 0.84 MEN1 (0.61) TSHRALDH1A1HPGDMEN1KMT2A
SCHEMBL27028823 0.84 ESR1 (0.59) TSHRALDH1A1HPGDMEN1KMT2A
SCHEMBL8969745 0.84 TSHR (0.51) TSHRALDH1A1HPGDMEN1KMT2A
Glycidol SCHEMBL20637749 0.83 ESR1 (0.50) TSHRALDH1A1HPGDMEN1KMT2A
SCHEMBL29227871 0.83 MEN1 (0.58) TSHRALDH1A1HPGDMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12030971-B2 Two-part cyanoacrylate curable adhesive system HENKEL AG & CO. KGAA (DE) 2024-07-09 US disclosed
WO-2024003053-A1 METHOD OF UNDERWATER BONDING HENKEL AG & CO. KGAA (DE) 2024-01-04 WO disclosed
US-20220411645-A1 RADIATION CURABLE COATING COMPOSITIONS FOR LIGHT FILTERING ESSILOR INTERNATIONAL (FR) 2022-12-29 US disclosed
CN-114729098-A Radiation curable coating compositions for optical filtering 依视路国际公司 2022-07-08 CN disclosed
US-20210395571-A1 TWO-PART, CYANOACRYLATE/CATIONICALLY CURABLE ADHESIVE SYSTEMS HENKEL AG & CO. KGAA (DE) 2021-12-23 US disclosed
US-20210171686-A1 Two-Part Cyanoacrylate Curable Adhesive System HENKEL AG & CO. KGAA (DE) 2021-06-10 US disclosed
US-20210147597-A1 Two-Part Cyanoacrylate Curable Adhesive System Henkel IP & Holding GmbH (DE) 2021-05-20 US disclosed
US-10921725-B2 Printing substrates HP INDIGO B.V. (NL) 2021-02-16 US disclosed
EP-2970718-B1 TWO-PART, CYANOACRYLATE/CATIONICALLY CURABLE ADHESIVE SYSTEMS Henkel IP & Holding GmbH (DE) 2020-04-22 EP disclosed
US-20190018333-A1 PRINTING SUBSTRATES HP INDIGO B.V. (NL) 2019-01-17 US disclosed
US-20080076886-A1 Backbones of polyethers, perfluorinated polyethers, polydimethylsiloxanes and hydroxy terminated polybutadienes coupled to phenyl, biphenyl, bisphenol A, bisphenol F, bisphenol S, bisphenol E, allyl, alkyl, alkenyl, carboxy, N-carbamoyl, cyclic amides, epoxy and a thermosetting component; toughening LOCTITE (R&D) LIMITED 2008-03-27 US disclosed
US-20080064780-A1 Radiation curable resin composition and rapid prototyping process using the same DSM IP ASSETS B.V. (NL) 2008-03-13 US disclosed
US-7338747-B2 Photoresist composition and method pattern forming using the same INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2008-03-04 US disclosed
US-20070154840-A1 Radiation curable resin composition and rapid prototyping process using the same DSM IP ASSETS B.V. (NL) 2007-07-05 US disclosed
US-7183040-B2 Radiation curable resin composition and rapid prototyping process using the same DSM IP ASSETS B.V. (NL) 2007-02-27 US disclosed
EP-1702003-A1 LASER WELDABLE POLYESTER COMPOSITION AND PROCESS FOR LASER WELDING E.I. Dupont de Nemours and Company, Inc. (US) 2006-09-20 EP disclosed
US-20050171321-A1 Laser weldable polyester composition and process for laser welding E. I. DU PONT DE NEMOURS AND COMPANY 2005-08-04 US disclosed
WO-2005068555-A1 LASER WELDABLE POLYESTER COMPOSITION AND PROCESS FOR LASER WELDING E.I. DUPONT DE NEMOURS AND COMPANY (US) 2005-07-28 WO disclosed
US-20040142272-A1 Photoresist composition and method pattern forming using the same INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2004-07-22 US disclosed
US-20040142274-A1 Radiation curable resin composition and rapid prototyping process using the same STRATASYS INC. 2004-07-22 US disclosed