SCHEMBL2177536

SCHEMBL2177536

Clc1ccccc1Cc1nc2ccccc2[nH]1

nearest known ligand 0.73

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 4/20 0.64
MAPT P10636 2/20 0.64
KDM4E B2RXH2 1/20 0.64
NPC1 O15118 1/20 0.61
RAB9A P51151 1/20 0.61
SMN1; SMN2 Q16637 1/20 0.61
GAA P10253 2/20 0.60
PKM P14618 2/20 0.56
HTT P42858 1/20 0.56
HKDC1 Q2TB90 1/20 0.56
EGFR P00533 2/20 0.56
ERBB2 P04626 1/20 0.56
CYP1A2 P05177 1/20 0.55
CYP3A4 P08684 1/20 0.55
CYP2D6 P10635 1/20 0.55
CYP2C9 P11712 1/20 0.55
CYP2C19 P33261 1/20 0.55
L3MBTL1 Q9Y468 1/20 0.55
DDAH1 O94760 1/20 0.54
POLB P06746 1/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29810805 0.84 EGFR (0.59) LMNAMAPTKDM4ENPC1RAB9A
SCHEMBL2948135 0.84 EGFR (0.59) LMNAMAPTKDM4ENPC1RAB9A
SCHEMBL15643363 0.83 GAA (0.60) LMNANPC1RAB9ASMN1; SMN2GAA
SCHEMBL31305514 0.83 POLB (0.68) LMNAKDM4ENPC1RAB9ASMN1; SMN2
SCHEMBL26110450 0.83 POLB (0.68) LMNAKDM4ENPC1RAB9ASMN1; SMN2
SCHEMBL7436454 0.82 LMNA (0.52) LMNAMAPTKDM4ENPC1RAB9A
SCHEMBL230024 0.82 GAA (0.78) LMNAMAPTNPC1RAB9ASMN1; SMN2
SCHEMBL6887750 0.80 GAA (0.73) LMNAMAPTNPC1RAB9AGAA
SCHEMBL29822675 0.80 GAA (0.60) LMNAMAPTGAAPKMHTT
SCHEMBL4119398 0.80 EGFR (0.74) LMNAMAPTNPC1RAB9AGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8703243-B2 Anti-tarnish coatings ENTHONE INC. (US) 2014-04-22 US claimed
US-20120175022-A1 ANTI-TARNISH COATINGS ENTHONE INC. (US) 2012-07-12 US claimed
US-7972655-B2 Anti-tarnish coatings ENTHONE INC. (US) 2011-07-05 US claimed
US-20100291303-A1 ANTI-TARNISH COATINGS ENTHONE INC. (US) 2010-11-18 US claimed
EP-2220009-A1 ANTI-TARNISH COATING Enthone, Inc. (US) 2010-08-25 EP claimed
WO-2009067446-A1 ANTI-TARNISH COATING ENTHONE INC. (US) 2009-05-28 WO claimed
EP-1097618-B1 POST-TREATMENT FOR COPPER ON PRINTED CIRCUIT BOARDS FRYS METALS INC DBA ALPHA METALS INC (US) 2003-03-26 EP claimed
US-6294220-B1 IMPROVED CHEMICAL RESISTANCE CAN BE ACCOMPLISHED BY CONVERTING MOST OF THE CUPRIC-BASED ORGANOMETALLIC COMPOUND ON THE SURFACE INTO A CUPROUS-BASED ORGANOMETALLIC CONVERSION COATING. ALPHA METALS, INC. 2001-09-25 US claimed
EP-1097618-A1 POST-TREATMENT FOR COPPER ON PRINTED CIRCUIT BOARDS FRY'S METALS, INC. d/b/a ALPHA METALS, INC. (US) 2001-05-09 EP claimed
WO-2000002426-A1 POST-TREATMENT FOR COPPER ON PRINTED CIRCUIT BOARDS FRY'S METALS, INC. D/B/A ALPHA METALS, INC. (US) 2000-01-13 WO claimed
US-5362334-A Chemically forming protective layer on metal surface by treating with aqueous solution of benzimidazole 2-substituted with halogen, haloalkyl or haloaryl MACDERMID, INCORPORATED (US) 1994-11-08 US claimed
US-3970535-A Photopolymerization process utilizing a 2-methyl-substituted benzimidazole as a photosensitizer SCM CORPORATION (US) 1976-07-20 US claimed
EP-2142485-B1 METALLIC SURFACE ENHANCEMENT MACDERMID ENTHONE INC (US) 2019-07-24 EP disclosed
US-9865952-B2 Plug contact with organic coating and printed circuit board arrangement CONTINENTAL AUTOMOTIVE GMBH (DE) 2018-01-09 US disclosed
US-20170179628-A1 PLUG CONTACT WITH ORGANIC COATING AND PRINTED CIRCUIT BOARD ARRANGEMENT CONTINENTAL AUTOMOTIVE GMBH (DE) 2017-06-22 US disclosed
CN-102548248-B Printed circuit board and manufacturing method thereof SAMSUNG ELECTRO-MECHANICS CO.,LTD. (KR) 2016-01-20 CN disclosed
WO-2002024974-A2 PROCESS FOR TREATING ADHESION PROMOTED METAL SURFACES SHIPLEY COMPANY, L.L.C. (US) 2002-03-28 WO disclosed
US-6294220-B1 IMPROVED CHEMICAL RESISTANCE CAN BE ACCOMPLISHED BY CONVERTING MOST OF THE CUPRIC-BASED ORGANOMETALLIC COMPOUND ON THE SURFACE INTO A CUPROUS-BASED ORGANOMETALLIC CONVERSION COATING. ALPHA METALS, INC. 2001-09-25 US disclosed
EP-1097618-A1 POST-TREATMENT FOR COPPER ON PRINTED CIRCUIT BOARDS FRY'S METALS, INC. d/b/a ALPHA METALS, INC. (US) 2001-05-09 EP disclosed
WO-2000002426-A1 POST-TREATMENT FOR COPPER ON PRINTED CIRCUIT BOARDS FRY'S METALS, INC. D/B/A ALPHA METALS, INC. (US) 2000-01-13 WO disclosed