Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EGFR | P00533 | 3/20 | 0.59 |
| ▸ | ERBB2 | P04626 | 2/20 | 0.59 |
| ▸ | LMNA | P02545 | 4/20 | 0.55 |
| ▸ | GAA | P10253 | 3/20 | 0.55 |
| ▸ | MAPT | P10636 | 3/20 | 0.55 |
| ▸ | PKM | P14618 | 3/20 | 0.55 |
| ▸ | HTT | P42858 | 2/20 | 0.55 |
| ▸ | HKDC1 | Q2TB90 | 1/20 | 0.55 |
| ▸ | RAB9A | P51151 | 6/20 | 0.52 |
| ▸ | NPC1 | O15118 | 5/20 | 0.52 |
| ▸ | POLB | P06746 | 3/20 | 0.52 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.52 |
| ▸ | MEN1 | O00255 | 2/20 | 0.52 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.52 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.52 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.51 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.51 |
| ▸ | ALPL | P05186 | 1/20 | 0.51 |
| ▸ | GLA | P06280 | 1/20 | 0.51 |
| ▸ | ALPG | P10696 | 1/20 | 0.51 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29810805 | 1.00 | EGFR (0.59) | EGFRERBB2LMNAGAAMAPT | |
| SCHEMBL30956287 | 0.88 | TDP1 (0.46) | EGFRERBB2LMNAGAAMAPT | |
| SCHEMBL2177536 | 0.84 | LMNA (0.64) | EGFRERBB2LMNAGAAMAPT | |
| SCHEMBL17533775 | 0.81 | EGFR (0.50) | EGFRERBB2LMNAGAAMAPT | |
| SCHEMBL19377857 | 0.79 | EGFR (0.46) | EGFRERBB2LMNAMAPTPKM | |
| SCHEMBL30956278 | 0.79 | TDP1 (0.41) | EGFRERBB2POLBTDP1 | |
| SCHEMBL30956286 | 0.79 | TDP1 (0.55) | EGFRERBB2MAPTRAB9AMEN1 | |
| SCHEMBL17513429 | 0.79 | PTGS2 (0.54) | LMNAMAPTPKMRAB9ANPC1 | |
| SCHEMBL19377886 | 0.78 | EGFR (0.43) | EGFRERBB2LMNAGAAMAPT | |
| SCHEMBL721860 | 0.78 | GAA (0.75) | EGFRERBB2LMNAGAAMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117966165-A | Corrosion prevention and inhibition method for transmission line pole tower | 中国南方电网有限责任公司超高压输电公司大理局 | 2024-05-03 | — | — | CN | claimed |
| CN-116206878-A | Magnetic powder with superhydrophobic surface and preparation method and application thereof | 江西中石新材料有限公司 | 2023-06-02 | — | — | CN | claimed |
| CN-113943935-A | Method for improving OSP process production efficiency | 奥士康精密电路（惠州）有限公司 | 2022-01-18 | — | — | CN | claimed |
| CN-111360450-B | Organic solderability preservative and preparation method of organic copper coordination polymer film | 电子科技大学 | 2021-08-17 | — | — | CN | claimed |
| CN-109735838-B | Selective organic weldable protective agent for copper surface | 广东省石油与精细化工研究院 | 2021-06-29 | — | — | CN | claimed |
| CN-111360450-A | Organic solderability preservative and preparation method of organic copper coordination polymer film | 电子科技大学 | 2020-07-03 | — | — | CN | claimed |
| CN-109735838-A | A kind of copper face selectivity organic weldable protective agent | 广东省石油与精细化工研究院 | 2019-05-10 | — | — | CN | claimed |
| CN-104032295-B | A kind of copper bar plastics processing method | HEFEI AOFU SURFACE TREATMENT TECHNOLOGY Co.,Ltd. (CN) | 2016-05-18 | — | — | CN | claimed |
| US-20250215572-A1 | SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY | SHIKOKU CHEMICALS CORPORATION (JP) | 2025-07-03 | — | — | US | disclosed |
| EP-4506488-A1 | SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY | Shikoku Chemicals Corporation (JP) | 2025-02-12 | — | — | EP | disclosed |
| US-12157837-B2 | Adhesive composition, method for producing surface-treated metal member, and method for producing metal-resin composite body | MEC COMPANY LTD. (JP) | 2024-12-03 | — | — | US | disclosed |
| CN-118002982-A | Organic solderability preservative and preparation method and application thereof | 广东省科学院化工研究所 | 2024-05-10 | — | — | CN | disclosed |
| CN-117966165-A | Corrosion prevention and inhibition method for transmission line pole tower | 中国南方电网有限责任公司超高压输电公司大理局 | 2024-05-03 | — | — | CN | disclosed |
| CN-117966165-A | Corrosion prevention and inhibition method for transmission line pole tower | 中国南方电网有限责任公司超高压输电公司大理局 | 2024-05-03 | — | — | CN | disclosed |
| US-7754105-B2 | Water-soluble preflux and usage of the same | SHIKOKU CHEMICALS CORPORATION (JP) | 2010-07-13 | — | — | US | disclosed |
| US-20080318070-A1 | Water-Soluble Preflux and Usage of the Same | SHIKOKU CHEMICALS CORPORATION (JP) | 2008-12-25 | — | — | US | disclosed |
| EP-1886759-A1 | WATER-SOLUBLE PREFLUX AND USE THEREOF | SHIKOKU CHEMICALS CORPORATION (JP) | 2008-02-13 | — | — | EP | disclosed |
| EP-0791671-B1 | Surface treating agent for copper or copper alloy | SHIKOKU CHEM (JP) | 1999-06-16 | — | — | EP | disclosed |
| US-5795409-A | MIXTURE OF A (BENZ)IMIDAZOLE COMPOUND, CHELATE COMPOUND AND IRON | SHIKOKU CHEMICALS CORPORATION (JP) | 1998-08-18 | — | — | US | disclosed |
| EP-0791671-A1 | Surface treating agent for copper or copper alloy | SHIKOKU CHEMICALS CORPORATION (JP) | 1997-08-27 | — | — | EP | disclosed |