SCHEMBL21775835

SCHEMBL21775835

Cc1ccc(C(c2cc(C)c(Oc3ccc(O)cc3)c(C)c2)c2cc(C)c(Oc3ccc(O)cc3)c(C)c2)cc1

nearest known ligand 0.41

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ACHE P22303 1/20 0.41
AR P10275 1/20 0.40
MEN1 O00255 2/20 0.39
KMT2A Q03164 2/20 0.39
ESR1 P03372 1/20 0.39
ESR2 Q92731 1/20 0.39
NPBWR1 P48145 1/20 0.39
LTA4H P09960 3/20 0.38
THRB P10828 3/20 0.36
THRA P10827 1/20 0.36
KDM4E B2RXH2 1/20 0.36
GAA P10253 1/20 0.36
MAPT P10636 1/20 0.36
PCNA P12004 1/20 0.35
NR1H2 P55055 1/20 0.35
BAX Q07812 1/20 0.35
PTPN1 P18031 1/20 0.35
LMNA P02545 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23627374 0.88 PCNA (0.39) ARMEN1KMT2AESR1ESR2
SCHEMBL21775773 0.86 ACHE (0.48) ACHENPBWR1LTA4HMAPTLMNA
SCHEMBL11529983 0.79 MEN1 (0.52) ACHEARMEN1KMT2AESR1
SCHEMBL67773 0.77 MEN1 (0.54) ARMEN1KMT2AESR1ESR2
SCHEMBL13695140 0.77 ACHE (0.68) ACHEARMEN1KMT2AESR1
SCHEMBL36600 0.77 ACHE (0.68) ACHEARMEN1KMT2AESR1
SCHEMBL21775766 0.76 SCN8A (0.39) ACHEMEN1KMT2AESR1ESR2
SCHEMBL23627427 0.74 SLC2A1 (0.42) ACHEARMEN1KMT2ANPBWR1
SCHEMBL21241774 0.74 PTGS1 (0.48) ACHEMEN1KMT2AKDM4EGAA
SCHEMBL757737 0.74 ESR1 (0.44) ACHEARESR1ESR2MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2020040161-A1 COMPOUND, COMPOSITION CONTAINING SAME, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING INSULATING FILM 三菱瓦斯化学株式会社 2020-02-27 WO disclosed