SCHEMBL2177668

SCHEMBL2177668

CC(C)=C(C)[SiH2][O]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10588195 0.64
SCHEMBL15792303 0.61
SCHEMBL3792326 0.61
SCHEMBL10488869 0.54 LMNA (0.38)
SCHEMBL4816215 0.54
SCHEMBL3099496 0.54
SCHEMBL134350 0.54
SCHEMBL709358 0.53
Bicarbonate SCHEMBL4832988 0.50 FFAR3 (0.60)
Ammonia Solution, Strong SCHEMBL4629937 0.49

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20030092336-A1 Durable and reusable multi-layer composite CASTRO HUGO (US) 2003-05-15 US claimed
CN-116075552-B Heat-conductive two-liquid addition-curing type organic silicon composition and preparation method thereof 信越化学工业株式会社 2024-06-21 CN disclosed
EP-4365239-A1 ADDITION-CURABLE SILICONE RUBBER COMPOSITION AND CURED SILICONE RUBBER PRODUCT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-05-08 EP disclosed
CN-116783251-A Oil-permeable silicone rubber composition 信越化学工业株式会社 2023-09-19 CN disclosed
EP-3058932-B1 SILICONE ELASTOMER COMPOSITION FOR USE AS DENTAL IMPRESSION MATERIAL SHINETSU CHEMICAL CO (JP) 2023-07-26 EP disclosed
CN-116075552-A Heat-conductive two-liquid addition-curing type organic silicon composition and preparation method thereof 信越化学工业株式会社 2023-05-05 CN disclosed
US-11242457-B2 Millable silicone rubber composition and electric-field relaxation layer SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-02-08 US disclosed
US-20200407559-A1 MILLABLE SILICONE RUBBER COMPOSITION AND ELECTRIC-FIELD RELAXATION LAYER SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-12-31 US disclosed
EP-3699238-A1 MILLABLE SILICONE RUBBER COMPOSITION AND ELECTRIC-FIELD RELAXATION LAYER Shin-Etsu Chemical Co., Ltd. (JP) 2020-08-26 EP disclosed
EP-2519409-B1 RELEASE FILM AND METHOD FOR MANUFACTURING THE SAME LG HAUSYS LTD (KR) 2018-08-29 EP disclosed
EP-3058932-A1 SILICONE ELASTOMER COMPOSITION FOR USE AS DENTAL IMPRESSION MATERIAL Shin-Etsu Chemical Co., Ltd. (JP) 2016-08-24 EP disclosed
EP-2519409-A2 RELEASE FILM AND METHOD FOR MANUFACTURING THE SAME LG Hausys, Ltd. (KR) 2012-11-07 EP disclosed
US-20120231223-A1 RELEASE FILM AND METHOD FOR MANUFACTURING THE SAME LG HAUSYS, LTD. (KR) 2012-09-13 US disclosed
WO-2011081446-A2 RELEASE FILM AND METHOD FOR MANUFACTURING THE SAME LG HAUSYS, LTD. (KR) 2011-07-07 WO disclosed
US-20090191414-A1 Thermoconductive Silicone Elastomer, Thermoconductive Silicone Elastomer Composition and Thermoconductive Medium DOW CORNING TORAY CO., LTD. (JP) 2009-07-30 US disclosed
EP-1928970-A1 THERMOCONDUCTIVE SILICONE ELASTOMER, THERMOCONDUCTIVE SILICONE ELASTOMER COMPOSITION AND THERMOCONDUCTIVE MEDIUM Dow Corning Toray Co., Ltd. (JP) 2008-06-11 EP disclosed
WO-2007037019-A1 THERMOCONDUCTIVE SILICONE ELASTOMER, THERMOCONDUCTIVE SILICONE ELASTOMER COMPOSITION AND THERMOCONDUCTIVE MEDIUM DOW CORNING TORAY CO., LTD. (JP) 2007-04-05 WO disclosed
US-20030092336-A1 Durable and reusable multi-layer composite CASTRO HUGO (US) 2003-05-15 US disclosed
EP-0838490-A2 Method for bonding silicone elastomer to a substrate DOW CORNING S.A. (BE) 1998-04-29 EP disclosed
US-5085894-A Cleaning with polydiorganosiloxane, applying room temperature vulcanizable silicone-elastomer-forming composition DOW CORNING S.A. (FR) 1992-02-04 US disclosed