SCHEMBL2179903

SCHEMBL2179903

C/C=C\C(=O)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL37099 1.00
SCHEMBL182365 1.00
Methyl Alcohol SCHEMBL5706210 0.97
SCHEMBL30753633 0.97
Methylamine SCHEMBL11680311 0.94
SCHEMBL8952295 0.89 NFE2L2 (0.65)
Isopropylamine SCHEMBL11683394 0.87 HCAR2 (0.55)
Dimethyl Maleate SCHEMBL28874848 0.84 HCAR2 (0.76)
SCHEMBL2575346 0.83 NFE2L2 (0.50)
Propylamine SCHEMBL10560630 0.83 HCAR2 (0.50)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240059818-A1 METHYL METHACRYLATE-CONTAINING COMPOSITION AND METHYL METHACRYLATE POLYMER PRODUCTION METHOD MITSUBISHI CHEMICAL CORPORATION (JP) 2024-02-22 US claimed
CN-117242103-A Methyl methacrylate-containing composition and method for producing methyl methacrylate polymer 三菱化学株式会社 2023-12-15 CN claimed
WO-2026100491-A1 EPOXY RESIN COMPOSITION, CURED OBJECT, UNDERFILL MATERIAL, ADHESIVE, AND SEMICONDUCTOR PACKAGE AND PRODUCTION METHOD THEREFOR 旭化成株式会社 2026-05-15 WO disclosed
WO-2026100487-A1 UNDERFILL MATERIAL, CURED PRODUCT, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SAME 旭化成株式会社 2026-05-15 WO disclosed
EP-2958562-B1 ANTIDIABETIC BICYCLIC COMPOUNDS MERCK SHARP & DOHME LLC (US) 2025-09-10 EP disclosed
EP-4610284-A1 MONOMER COMPOSITION, METHACRYLIC RESIN COMPOSITION AND PRODUCTION METHOD THEREFOR, AND MOLDED RESIN OBJECT Mitsubishi Chemical Corporation (JP) 2025-09-03 EP disclosed
US-20250250376-A1 MONOMER COMPOSITION, METHACRYLIC RESIN COMPOSITION AND PRODUCTION METHOD THEREFOR, AND MOLDED RESIN OBJECT MITSUBISHI CHEMICAL CORPORATION (JP) 2025-08-07 US disclosed
CN-120092027-A Monomer composition, methacrylic resin composition, method for producing same, and resin molded article 三菱化学株式会社 2025-06-03 CN disclosed
CN-115803323-B Amine imide compound, amine imide composition, curing agent, epoxy resin composition, process for producing amine imide compound, sealing material, and adhesive 旭化成株式会社 2025-05-16 CN disclosed
CN-119923418-A Methacrylic acid-containing composition, method for producing methacrylic acid ester, polymerizable composition, and method for producing methacrylic acid polymer 三菱化学株式会社 2025-05-02 CN disclosed
WO-2025028605-A1 CURING AGENT, EPOXY RESIN COMPOSITION, CURED OBJECT, SEALING MATERIAL, AND ADHESIVE 旭化成株式会社 2025-02-06 WO disclosed
WO-2009106877-A2 PROCESS DAVY PROCESS TECHNOLOGY LIMITED (GB) 2009-09-03 WO disclosed
US-20090023742-A1 THIAZOLONES FOR USE AS PI3 KINASE INHIBITORS SMITHKLINE BEECHAM CORPORATION 2009-01-22 US disclosed
US-20090023742-A1 THIAZOLONES FOR USE AS PI3 KINASE INHIBITORS SMITHKLINE BEECHAM CORPORATION 2009-01-22 US disclosed
WO-2008150837-A1 METHODS OF TREATMENT SMITHKLINE BEECHAM CORPORATION (US) 2008-12-11 WO disclosed
EP-1567112-B1 THIAZOLIDIN-4-ONES FOR INHIBITING hYAK3 PROTEINS SMITHKLINE BEECHAM CORP (US) 2008-10-15 EP disclosed
WO-2007103754-A2 THIAZOLONES FOR USE AS PI3 KINASE INHIBITORS SMITHKLINE BEECHAM CORPORATION (US) 2007-09-13 WO disclosed
US-20070054837-A1 Bicyclic lactones, perfumery uses thereof, processes for preparing same and intermediates therefor INTERNATIONAL FLAVORS & FRAGRANCES INC. 2007-03-08 US disclosed
US-7169747-B2 Bicyclic lactones, perfumery uses thereof, processes for preparing same and intermediates therefor INTERNATIONAL FLAVORS & FRAGRANCES INC. (US) 2007-01-30 US disclosed
EP-0269046-B1 PROCESS FOR THE ISOMERIZATION OF 2 PENTENOIC ACID ESTERS INTO 3 PENTENOIC ACID ESTERS BASF Aktiengesellschaft (DE) 1992-04-22 EP disclosed