SCHEMBL21831925

SCHEMBL21831925

CCCCCC(=O)OC(C)=O.[Ag]

nearest known ligand 0.54

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.54
LMNA P02545 2/20 0.50
PAM P19021 2/20 0.48
CES2 O00748 4/20 0.48
CES1 P23141 4/20 0.48
ALDH1A1 P00352 2/20 0.48
MAPT P10636 2/20 0.47
MAPK1 P28482 1/20 0.47
AKR1B1 P15121 1/20 0.46
PRKCA P17252 2/20 0.46
TSHR P16473 2/20 0.46
SLC22A6 Q4U2R8 1/20 0.44
SLC22A8 Q8TCC7 1/20 0.44
GPR84 Q9NQS5 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21831924 0.98 DGKA (0.57) DGKALMNAPAMCES2CES1
SCHEMBL1238292 0.98 DGKA (0.56) DGKALMNAPAMCES2CES1
SCHEMBL627978 0.95 DGKA (0.59) DGKALMNAPAMCES2CES1
SCHEMBL1698285 0.95 DGKA (0.59) DGKALMNAPAMCES2CES1
SCHEMBL130890 0.95 DGKA (0.59) DGKALMNAPAMCES2CES1
SCHEMBL2235744 0.95 DGKA (0.59) DGKALMNAPAMCES2CES1
SCHEMBL8603407 0.95 DGKA (0.54) DGKALMNAPAMCES2CES1
SCHEMBL20482050 0.95 DGKA (0.54) DGKALMNAPAMCES2CES1
SCHEMBL22126637 0.95 DGKA (0.59) DGKALMNAPAMCES2CES1
SCHEMBL20482068 0.95 DGKA (0.54) DGKALMNAPAMCES2CES1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104662109-B Silver-colored ink composite, electric conductor and communication equipment 凸版资讯股份有限公司 2017-08-01 CN claimed
CN-104662109-A Silver ink composition, conductor and communication device TOPPAN FORMS CO LTD 2015-05-27 CN claimed
EP-4424441-A1 SINTERED MATERIAL, METAL SINTERED COMPACT, MANUFACTURING METHOD FOR SINTERED MATERIAL, MANUFACTURING METHOD FOR JOINED BODY, AND JOINED BODY Toppan Holdings Inc. (JP) 2024-09-04 EP disclosed
US-20240278321-A1 SINTERED MATERIAL, METAL SINTERED COMPACT, METHOD FOR PRODUCING SINTERED MATERIAL, METHOD FOR PRODUCING JOINED BODY, AND JOINED BODY TOPPAN HOLDINGS INC. (JP) 2024-08-22 US disclosed
WO-2023074580-A1 SINTERED MATERIAL, METAL SINTERED COMPACT, MANUFACTURING METHOD FOR SINTERED MATERIAL, MANUFACTURING METHOD FOR JOINED BODY, AND JOINED BODY トッパン・フォームズ株式会社 2023-05-04 WO disclosed
WO-2020071471-A1 METHOD FOR BONDING METALLIC MEMBERS, BONDED METALLIC-MEMBER OBJECT, AND CIRCUIT BOARD トッパン・フォームズ株式会社 2020-04-09 WO disclosed
CN-106416432-B Wiring board 凸版资讯股份有限公司 2020-03-24 CN disclosed
CN-104662109-B Silver-colored ink composite, electric conductor and communication equipment 凸版资讯股份有限公司 2017-08-01 CN disclosed
CN-104662109-A Silver ink composition, conductor and communication device TOPPAN FORMS CO LTD 2015-05-27 CN disclosed