SCHEMBL21834482

SCHEMBL21834482

Nc1ccc(C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)F)cc1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KIF11 P52732 2/20 0.42
ALDH1A1 P00352 2/20 0.33
KDM4E B2RXH2 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
MAOB P27338 2/20 0.33
MAPT P10636 4/20 0.32
MEN1 O00255 2/20 0.32
KMT2A Q03164 2/20 0.32
USP2 O75604 2/20 0.32
TSHR P16473 1/20 0.32
PTGS1 P23219 2/20 0.32
HPGD P15428 2/20 0.31
MAPK1 P28482 2/20 0.31
TP53 P04637 1/20 0.31
POLB P06746 1/20 0.31
ALOX15 P16050 1/20 0.31
XBP1 P17861 1/20 0.31
CYP1A2 P05177 1/20 0.31
CYP2C9 P11712 1/20 0.31
CYP2C19 P33261 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21811270 0.98 KIF11 (0.41) KIF11ALDH1A1KDM4ETDP1MAOB
SCHEMBL25279748 0.94 KIF11 (0.43) KIF11ALDH1A1KDM4ETDP1MAOB
SCHEMBL3146868 0.85 KIF11 (0.46) KIF11ALDH1A1KDM4ETDP1MAOB
SCHEMBL7080175 0.85 KIF11 (0.54) KIF11ALDH1A1KDM4ETDP1MAOB
SCHEMBL7076981 0.83 KIF11 (0.52) KIF11ALDH1A1KDM4ETDP1MAOB
SCHEMBL7078537 0.83 KIF11 (0.52) KIF11ALDH1A1KDM4ETDP1MAOB
SCHEMBL17817842 0.83 KIF11 (0.52) KIF11ALDH1A1KDM4ETDP1MAOB
SCHEMBL7072713 0.80 KIF11 (0.54) KIF11ALDH1A1KDM4ETDP1MAOB
SCHEMBL28511043 0.80 KIF11 (0.57) KIF11ALDH1A1KDM4ETDP1MAOB
SCHEMBL447473 0.79 KIF11 (0.48) KIF11ALDH1A1KDM4ETDP1MAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2020066975-A1 RESIN COMPOSITION, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2020-04-02 WO disclosed
WO-2020066976-A1 RESIN COMPOSITION, CURED FILM, MULTILAYER BODY, METHOD FOR PRODUCING CURED FILM AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2020-04-02 WO disclosed