SCHEMBL2186702

SCHEMBL2186702

C(#CC12CC3CC(C#Cc4ccccc4)(C1)CC(C14CC5CC(CC(C5)C1)C4)(C3)C2)c1ccccc1

nearest known ligand 0.32

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.32
GRM5 P41594 2/20 0.31
GRIN2D O15399 1/20 0.30
GRIN3B O60391 1/20 0.30
GRIN1 Q05586 1/20 0.30
GRIN2A Q12879 1/20 0.30
GRIN2B Q13224 1/20 0.30
GRIN2C Q14957 1/20 0.30
GRIN3A Q8TCU5 1/20 0.30
HTT P42858 1/20 0.30
HIF1A Q16665 1/20 0.30
EPAS1 Q99814 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2190267 0.94 APP (0.37) APPGRM5
SCHEMBL2188183 0.93 GRM5 (0.35) APPGRM5GRIN2DGRIN3BGRIN1
SCHEMBL2187622 0.91 GRM5 (0.35) APPGRM5
SCHEMBL4100078 0.87 APP (0.42) APPGRM5HTT
SCHEMBL2188668 0.86 GRM5 (0.37) APPGRM5GRIN2DGRIN3BGRIN1
SCHEMBL2192814 0.85 GRM5 (0.35) APPGRM5GRIN2DGRIN3BGRIN1
SCHEMBL4104795 0.84 APP (0.39) APPGRM5GRIN2DGRIN3BGRIN1
SCHEMBL2747858 0.84 APP (0.42) APPGRM5HTTHIF1AEPAS1
SCHEMBL2746535 0.80 RBP4 (0.35) GRM5
SCHEMBL2190052 0.76 APP (0.46) APPGRM5HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8524847-B2 Organic insulating material, varnish for resin film using the same, resin film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2013-09-03 US disclosed
EP-2157107-B1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO (JP) 2013-05-08 EP disclosed
US-20110172351-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2011-07-14 US disclosed
EP-2157107-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2010-02-24 EP disclosed
US-20100004379-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2010-01-07 US disclosed
US-20090318610-A1 ORGANIC INSULATING MATERIALS, VARNISHES FOR ORGANIC INSULATING FILM EMPLOYING THEM, ORGANIC INSULATING FILMS AND SEMICONDUCTOR DEVICES SUMITOMO BAKELITE CO., LTD (JP) 2009-12-24 US disclosed
EP-2117009-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR ORGANIC INSULATING FILM USING THE SAME, ORGANIC INSULATING FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2009-11-11 EP disclosed