Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 8/20 | 0.45 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.45 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.43 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.41 |
| ▸ | TP53 | P04637 | 2/20 | 0.35 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.35 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.32 |
| ▸ | GLA | P06280 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14891221 | 0.87 | ALDH1A1 (0.54) | TSHRALDH1A1MAPK1SMN1; SMN2TDP1 | |
| SCHEMBL1563579 | 0.87 | TSHR (0.43) | TSHRALDH1A1MAPK1SMN1; SMN2TDP1 | |
| SCHEMBL6430794 | 0.86 | ALDH1A1 (0.53) | TSHRALDH1A1MAPK1SMN1; SMN2TDP1 | |
| SCHEMBL14231436 | 0.86 | ALDH1A1 (0.53) | TSHRALDH1A1MAPK1SMN1; SMN2TDP1 | |
| SCHEMBL7525287 | 0.84 | ALDH1A1 (0.51) | TSHRALDH1A1MAPK1SMN1; SMN2TDP1 | |
| SCHEMBL124924 | 0.84 | ALDH1A1 (0.47) | TSHRALDH1A1MAPK1SMN1; SMN2TDP1 | |
| Glycerin SCHEMBL23214508 | 0.84 | TSHR (0.48) | TSHRALDH1A1MAPK1SMN1; SMN2TDP1 | |
| Glycerin SCHEMBL700209 | 0.84 | TSHR (0.48) | TSHRALDH1A1MAPK1SMN1; SMN2TDP1 | |
| Glycerin SCHEMBL3295078 | 0.84 | TSHR (0.48) | TSHRALDH1A1MAPK1SMN1; SMN2TDP1 | |
| E968 SCHEMBL11703391 | 0.84 | TSHR (0.48) | TSHRALDH1A1MAPK1SMN1; SMN2TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6969919-B2 | Semiconductor package production method and semiconductor package | TEXAS INSTRUMENTS INCORPORATED (US) | 2005-11-29 | — | — | US | claimed |
| US-20050003577-A1 | Semiconductor package production method and semiconductor package | YAJIMA KIYOSHI (JP) | 2005-01-06 | — | — | US | claimed |
| US-6774496-B2 | Semiconductor package with a thermoset bond | TEXAS INSTRUMENTS INCORPORATED | 2004-08-10 | — | — | US | claimed |
| US-6716674-B2 | Method of forming a semiconductor package | TEXAS INSTRUMENTS INCORPORATED | 2004-04-06 | — | — | US | claimed |
| CN-110819203-A | Cationic photocuring composition and application thereof in photocuring field | 常州强力先端电子材料有限公司 | 2020-02-21 | — | — | CN | disclosed |
| US-8288072-B2 | Antireflection film; fast etching speed whcih reduces deformation; accuracy; 2,3-epoxypropyl methacrylate ester-styrene copolymer | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-10-16 | — | — | US | disclosed |
| US-8088554-B2 | Bottom resist layer composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD (JP) | 2012-01-03 | — | — | US | disclosed |
| US-7745104-B2 | Polymer having a hydrocarbon chain backbone and containing units derived from norbornadiene, indene, benzofuran, benzothiophene, acenaphthene, or vinyl pyrene, fluorene, phenanthrene, chrysene, naphthacene, pentacene, or acenaphthene; excellent etching resistance; shorter wavelengths | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-06-29 | — | — | US | disclosed |
| US-20100151382-A1 | Bottom resist layer composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-06-17 | — | — | US | disclosed |
| US-7687228-B2 | Antireflection film composition and patterning process using the same | SHIN ETSU CHEMICAL CO., LTD. (JP) | 2010-03-30 | — | — | US | disclosed |
| US-7655378-B2 | Negative resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-02-02 | — | — | US | disclosed |
| US-7476485-B2 | Resist lower layer film material and method for forming a pattern | SHIN-ESTU CHEMICAL CO., LTD. (JP) | 2009-01-13 | — | — | US | disclosed |
| US-6969919-B2 | Semiconductor package production method and semiconductor package | TEXAS INSTRUMENTS INCORPORATED (US) | 2005-11-29 | — | — | US | disclosed |
| US-20050003577-A1 | Semiconductor package production method and semiconductor package | YAJIMA KIYOSHI (JP) | 2005-01-06 | — | — | US | disclosed |
| US-20040259037-A1 | Resist lower layer film material and method for forming a pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-23 | — | — | US | disclosed |
| US-20040241577-A1 | Resist lower layer film material and method for forming a pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-02 | — | — | US | disclosed |
| US-6774496-B2 | Semiconductor package with a thermoset bond | TEXAS INSTRUMENTS INCORPORATED | 2004-08-10 | — | — | US | disclosed |
| US-6716674-B2 | Method of forming a semiconductor package | TEXAS INSTRUMENTS INCORPORATED | 2004-04-06 | — | — | US | disclosed |
| US-20030153121-A1 | Semiconductor package production method and semiconductor package | TEXAS INSTRUMENTS INCORPORATED (US) | 2003-08-14 | — | — | US | disclosed |
| US-20030049883-A1 | Semiconductor package production method and semiconductor package | TEXAS INSTRUMENTS INCORPORATED | 2003-03-13 | — | — | US | disclosed |